H10W 90/755
Between a chip and a laterally-adjacent insulating package substrate, interpose or rdl
Official title: {between a chip and a laterally-adjacent insulating package substrate, interpose or RDL}
H10W90/755 (Between a chip and a laterally-adjacent insulating package substrate, interpose or rdl) appears on 733 US grants and 1,084 published applications in this corpus.
Search patents in H10W- Granted patents
- 733
- Published applications
- 1,084
- Assignees
- 258
- Inventors
- 1,919
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 2 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 1 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 1 |
| 2003 | 1 | 3 |
| 2004 | 1 | 2 |
| 2005 | 1 | 1 |
| 2006 | 1 | 1 |
| 2007 | 1 | 2 |
| 2008 | 0 | 9 |
| 2009 | 0 | 1 |
| 2010 | 4 | 11 |
| 2011 | 8 | 30 |
| 2012 | 8 | 28 |
| 2013 | 24 | 26 |
| 2014 | 13 | 17 |
| 2015 | 34 | 44 |
| 2016 | 35 | 46 |
| 2017 | 42 | 42 |
| 2018 | 50 | 58 |
| 2019 | 47 | 61 |
| 2020 | 53 | 80 |
| 2021 | 51 | 76 |
| 2022 | 69 | 106 |
| 2023 | 59 | 119 |
| 2024 | 65 | 165 |
| 2025 | 75 | 91 |
| 2026 | 85 | 64 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Semiconductor package structure having a chip stack6 Oct 2026US 12,757,412 B2Changxin Memory Technologies, Inc.
- Electronic device with high draft angle package structure6 Oct 2026US 12,757,753 B2Texas Instruments Incorporated
- Semiconductor package having lead frame with slanted sections6 Oct 2026US 12,757,755 B2Alpha and Omega Semiconductor International LP
- Semiconductor module6 Oct 2026US 12,757,769 B2Shindengen Electric Manufacturing Co., Ltd.
- Isolator6 Oct 2026US 12,757,770 B2Kabushiki Kaisha Toshiba
- Semiconductor device package for press fit assembly8 Oct 2026US 2026/0314438 A1
- Power device package1 Oct 2026US 2026/0305466 A1GaNrich Semiconductor Corporation
- Power module package with molded via and dual side press-fit pin1 Oct 2026US 2026/0305495 A1Semiconductor Components Industries, LLC
- Semiconductor device24 Sep 2026US 2026/0293730 A1Rohm Co., Ltd.
- Semiconductor device17 Sep 2026US 2026/0282978 A1Mitsubishi Electric Corporation
Most cited
By later US patents
- Multichip module having a stacked chip arrangement358US 5,323,060 AMicron Semiconductor, Inc. · 1994
- Semiconductor package and method of mounting semiconductor die to opposite sides of TSV substrate95US 8,008,121 B2STATS ChipPAC, Ltd. · 2011
- Semiconductor device and method of bonding different size semiconductor die at the wafer level71US 8,993,377 B2STATS ChipPAC, Ltd. · 2015
- Power amplifier modules including related systems, devices, and methods66US 9,041,472 B2Skyworks Solutions, Inc. · 2015
- Semiconductor device and method of forming ultra thin multi-die face-to-face WLCSP60US 9,735,113 B2STATS ChipPAC Pte. Ltd. · 2017