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US 12,757,770 B2Granted
Isolator
AssigneesKabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage Corporation
InventorDaisuke Koike
Life of this patent
Estimating the term…
Abstract
An isolator according to one embodiment, includes a substrate and a plurality of leads. The substrate includes a lower surface, a plurality of coils, and a plurality of conductive parts. The lower surface has a quadrilateral shape. The plurality of coils includes a first coil, and a second coil. The plurality of conductive parts includes a first conductive part, a second conductive part, a third conductive part, and a fourth conductive part. The first conductive part includes a first terminal. The second conductive part includes a second terminal. The third conductive part includes a third terminal. The fourth conductive part includes a fourth terminal. The plurality of leads includes a first lead, a second lead, a third lead, and a fourth lead. The plurality of leads includes a metal.
Claims15
An isolator, comprising:
- a substrate;
- and
- a plurality of leads,
- the substrate including
- an upper surface extending along a plane perpendicular to a first direction,
- a lower surface at a side opposite to the upper surface,
- a plurality of coils, and
- a plurality of conductive parts;
- the lower surface having a quadrilateral shape including a first corner, a second corner, a third corner, and a fourth corner when viewed in plan along the first direction,
- the plurality of coils being located inside the substrate,
- the plurality of coils including a first coil, and a second coil facing the first coil,
- the plurality of conductive parts including a first conductive part, a second conductive part, a third conductive part, and a fourth conductive part,
- the first conductive part including a first terminal positioned at a first opening, the first opening being located at the first corner,
- the second conductive part including a second terminal positioned in a second opening, the second opening being located at the second corner,
- the third conductive part including a third terminal positioned at a third opening, the third opening being located at the third corner,
- the fourth conductive part including a fourth terminal positioned at a fourth opening, the fourth opening being located at the fourth corner,
- the plurality of leads including
- a first lead connected with the first terminal by solder,
- a second lead connected with the second terminal by solder,
- a third lead connected with the third terminal by solder, and
- a fourth lead connected with the fourth terminal by solder,
- the plurality of leads including a metal.
19 more elements
An isolator, comprising:
- a substrate;
- and
- a plurality of leads,
- the substrate including
- an upper surface extending along a plane perpendicular to a first direction,
- a lower surface at a side opposite to the upper surface,
- a plurality of coils, and
- a plurality of conductive parts,
- the plurality of coils being located inside the substrate,
- the plurality of coils including
- a first coil electrically connected with a first semiconductor chip, and
- a second coil facing the first coil, the second coil being electrically connected with a second semiconductor chip,
- the plurality of conductive parts including a first conductive part, a second conductive part, a third conductive part, and a fourth conductive part,
- the first conductive part including a first terminal positioned at a first opening,
- the first opening being provided in the lower surface,
- the second conductive part including a second terminal positioned at a second opening,
- the second opening being provided in the lower surface,
- the third conductive part including a third terminal positioned at a third opening,
- the third opening being provided in the lower surface,
- the fourth conductive part including a fourth terminal positioned at a fourth opening,
- the fourth opening being provided in the lower surface,
- the first conductive part, the second conductive part, the third conductive part, and the fourth conductive part each being electrically insulated from the plurality of coils,
- when viewed in plan along the first direction, the second terminal and the fourth terminal being positioned at a side opposite to the first and third terminals when viewed from a center of the substrate in a second direction,
- the second direction being perpendicular to the first direction,
- when viewed in plan along the first direction, the third conductive part and the fourth conductive part being positioned at a side opposite to the first and second conductive parts when viewed from a center of the substrate in a third direction,
- the third direction being perpendicular to the first and second directions,
- the plurality of leads including
- a first lead connected with the first terminal by solder,
- a second lead connected with the second terminal by solder,
- a third lead connected with the third terminal by solder, and
- a fourth lead connected with the fourth terminal by solder,
- the first lead, the second lead, the third lead, and the fourth lead each being electrically insulated from the first and second semiconductor chips,
- the plurality of leads including a metal.
30 more elements
Dependencies are inferred from the claim text.