H10W 90/754
Between a chip and a stacked insulating package substrate, interposer or rdl
Official title: {between a chip and a stacked insulating package substrate, interposer or RDL}
H10W90/754 (Between a chip and a stacked insulating package substrate, interposer or rdl) appears on 21,630 US grants and 23,543 published applications in this corpus.
Search patents in H10W- Granted patents
- 21,630
- Published applications
- 23,543
- Assignees
- 2,724
- Inventors
- 27,459
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 10 | 0 |
| 1977 | 6 | 0 |
| 1978 | 7 | 0 |
| 1979 | 6 | 0 |
| 1980 | 7 | 0 |
| 1981 | 8 | 0 |
| 1982 | 14 | 0 |
| 1983 | 21 | 0 |
| 1984 | 16 | 0 |
| 1985 | 36 | 0 |
| 1986 | 29 | 0 |
| 1987 | 46 | 0 |
| 1988 | 43 | 0 |
| 1989 | 59 | 0 |
| 1990 | 72 | 0 |
| 1991 | 82 | 0 |
| 1992 | 107 | 0 |
| 1993 | 102 | 0 |
| 1994 | 138 | 0 |
| 1995 | 142 | 0 |
| 1996 | 161 | 0 |
| 1997 | 232 | 0 |
| 1998 | 317 | 0 |
| 1999 | 340 | 0 |
| 2000 | 395 | 0 |
| 2001 | 482 | 229 |
| 2002 | 554 | 763 |
| 2003 | 637 | 739 |
| 2004 | 655 | 898 |
| 2005 | 626 | 1012 |
| 2006 | 638 | 977 |
| 2007 | 663 | 1106 |
| 2008 | 558 | 1163 |
| 2009 | 610 | 1108 |
| 2010 | 920 | 1075 |
| 2011 | 994 | 1062 |
| 2012 | 915 | 1074 |
| 2013 | 960 | 968 |
| 2014 | 928 | 964 |
| 2015 | 959 | 1042 |
| 2016 | 991 | 962 |
| 2017 | 952 | 921 |
| 2018 | 825 | 877 |
| 2019 | 884 | 872 |
| 2020 | 770 | 943 |
| 2021 | 691 | 849 |
| 2022 | 706 | 936 |
| 2023 | 680 | 775 |
| 2024 | 660 | 905 |
| 2025 | 606 | 699 |
| 2026 | 370 | 624 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Semiconductor storage device6 Oct 2026US 12,757,341 B2Kioxia Corporation
- Bondable pillars for wire bonds in a semiconductor package6 Oct 2026US 12,757,414 B2Micron Technology, Inc.
- Image sensor package including a chip stack structure6 Oct 2026US 12,757,506 B2Samsung Electronics Co., Ltd.
- Semiconductor packages with wettable flanks and related methods6 Oct 2026US 12,757,696 B2Semiconductor Components Industries, LLC
- Semiconductor device and electronic system including the same6 Oct 2026US 12,757,720 B2Samsung Electronics Co., Ltd.
- Electronic devices and methods of manufacturing electronic devices8 Oct 2026US 2026/0314399 A1Amkor Technology Singapore Holding Pte.Ltd.
- Power module with selective heat spreader8 Oct 2026US 2026/0314407 A1Microchip Technology Incorporated
- Power electronics module and inverter including a power electronics module8 Oct 2026US 2026/0314465 A1Schaeffler Technologies AG & Co. KG
- Semiconductor package having a multi-layer film structure8 Oct 2026US 2026/0314477 A1SanDisk Technologies LLC
- Three-dimensional chip stack with backside power distribution network8 Oct 2026US 2026/0314486 A1International Business Machines Corporation
Most cited
By later US patents
- Method of fabricating interconnect structure for package-on-package devices1,078US 9,048,222 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Polarless surface mounting light emitting diode1,041US 7,714,334 B22010
- System, method, and computer program product for improving memory systems1,021US 9,432,298 B1P4Tents1, LLC · 2016
- Ceramic emitter substrate831US 8,355,766 B2Masimo Corporation · 2013
- Multi-stack package-on-package structures744US 9,735,131 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2017