H10W 70/65
Shapes or dispositions of interconnections
H10W70/65 (Shapes or dispositions of interconnections) appears on 20,332 US grants and 25,236 published applications in this corpus.
Search patents in H10W- Granted patents
- 20,332
- Published applications
- 25,236
- Assignees
- 2,119
- Inventors
- 24,301
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 4 | 0 |
| 1978 | 8 | 0 |
| 1979 | 3 | 0 |
| 1980 | 10 | 0 |
| 1981 | 6 | 0 |
| 1982 | 6 | 0 |
| 1983 | 5 | 0 |
| 1984 | 7 | 0 |
| 1985 | 9 | 0 |
| 1986 | 11 | 0 |
| 1987 | 15 | 0 |
| 1988 | 16 | 0 |
| 1989 | 20 | 0 |
| 1990 | 22 | 0 |
| 1991 | 35 | 0 |
| 1992 | 23 | 0 |
| 1993 | 39 | 0 |
| 1994 | 60 | 0 |
| 1995 | 55 | 0 |
| 1996 | 61 | 0 |
| 1997 | 100 | 0 |
| 1998 | 114 | 0 |
| 1999 | 138 | 0 |
| 2000 | 166 | 0 |
| 2001 | 209 | 125 |
| 2002 | 268 | 308 |
| 2003 | 261 | 347 |
| 2004 | 329 | 413 |
| 2005 | 302 | 496 |
| 2006 | 299 | 450 |
| 2007 | 332 | 557 |
| 2008 | 318 | 542 |
| 2009 | 324 | 527 |
| 2010 | 451 | 535 |
| 2011 | 461 | 519 |
| 2012 | 480 | 576 |
| 2013 | 527 | 623 |
| 2014 | 627 | 795 |
| 2015 | 754 | 958 |
| 2016 | 985 | 1102 |
| 2017 | 1147 | 1263 |
| 2018 | 1123 | 1273 |
| 2019 | 1237 | 1531 |
| 2020 | 1311 | 1775 |
| 2021 | 1296 | 1749 |
| 2022 | 1324 | 1779 |
| 2023 | 1402 | 1817 |
| 2024 | 1356 | 1980 |
| 2025 | 1363 | 1896 |
| 2026 | 912 | 1300 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H10W 70/654Top-view layouts5,609
- H10W 70/652Cross-sectional shapes2,527
- H10W 70/657On sidewalls or bottom surfaces of the package substrates, interposers or redistribution1,064
- H10W 70/658For devices provided for in groups h10d8/00 - h10d48/00910
- H10W 70/6565Recessed into the surface of the package substrates, interposers, or redistribution layers92
Recent patents
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- Package structure and method for forming the same8 Oct 2026US 2026/0313918 A1Taiwan Semiconductor Manufacturing Company.Ltd
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Most cited
By later US patents
- Testing of semiconductor chips with microbumps1,870US 9,372,206 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Stacked semiconductor devices and methods of forming same1,870US 9,496,189 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Method of fabricating interconnect structure for package-on-package devices1,078US 9,048,222 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Methods and apparatus of wafer level package for heterogeneous integration technology1,051US 9,111,949 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Fan-out interconnect structure and method for forming same1,030US 9,368,460 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016