H10W 70/658
For devices provided for in groups h10d8/00 - h10d48/00
Official title: {for devices provided for in groups H10D8/00 - H10D48/00}
H10W70/658 (For devices provided for in groups h10d8/00 - h10d48/00) appears on 910 US grants and 1,215 published applications in this corpus.
Search patents in H10W- Granted patents
- 910
- Published applications
- 1,215
- Assignees
- 308
- Inventors
- 1,928
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 2 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 2 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 3 | 0 |
| 1991 | 1 | 0 |
| 1992 | 1 | 0 |
| 1993 | 1 | 0 |
| 1994 | 3 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 2 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 2 | 3 |
| 2002 | 5 | 5 |
| 2003 | 3 | 8 |
| 2004 | 6 | 6 |
| 2005 | 2 | 5 |
| 2006 | 9 | 8 |
| 2007 | 2 | 22 |
| 2008 | 2 | 5 |
| 2009 | 13 | 15 |
| 2010 | 12 | 41 |
| 2011 | 10 | 10 |
| 2012 | 17 | 17 |
| 2013 | 28 | 39 |
| 2014 | 39 | 39 |
| 2015 | 43 | 51 |
| 2016 | 68 | 85 |
| 2017 | 67 | 71 |
| 2018 | 50 | 41 |
| 2019 | 45 | 59 |
| 2020 | 58 | 71 |
| 2021 | 65 | 87 |
| 2022 | 64 | 112 |
| 2023 | 58 | 124 |
| 2024 | 91 | 114 |
| 2025 | 81 | 103 |
| 2026 | 50 | 74 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Semiconductor module arrangement6 Oct 2026US 12,757,794 B2Infineon Technologies AG
- Method of making a multi-chip package device6 Oct 2026US 12,757,800 B2Force Mos Technology Co., Ltd.
- Semiconductor module29 Sep 2026US 12,751,340 B2Fuji Electric Co., Ltd.
- Power semiconductor module15 Sep 2026US 12,740,471 B2Sansha Electric Manufacturing Company, Limited
- Efficient IGBT switching1 Sep 2026US 12,726,191 B2EHT Ventures LLC
- Semiconductor device, semiconductor module, and vehicle8 Oct 2026US 2026/0314507 A1Rohm Co., Ltd.
- Power semiconductor module and method of manufacturing the same1 Oct 2026US 2026/0305335 A1Infineon Technologies AG
- Semiconductor device24 Sep 2026US 2026/0293730 A1Rohm Co., Ltd.
- Power module17 Sep 2026US 2026/0282913 A1Hyundai Motor Company
- Power module17 Sep 2026US 2026/0282952 A1Hyundai Motor Company
Most cited
By later US patents
- Wireless radio frequency power semiconductor devices using high density interconnect171US 5,637,922 AGeneral Electric Company · 1997
- Flip-chip switching regulator142US 6,278,264 B1Volterra Semiconductor Corporation · 2001
- Cross-coupled transistor layouts in restricted gate level layout architecture127US 7,956,421 B2Tela Innovations, Inc. · 2011
- Semiconductor device with a number of bonding leads and method for producing the same124US 7,391,121 B2Infineon Technologies AG · 2008
- Efficient IGBT switching100US 8,963,377 B2Eagle Harbor Technologies, Inc. · 2015