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US 2026/0282952 A1Published application
Power module
AssigneesHyundai Motor Company, Kia Corporation
InventorsHan Jin DO, Dong Hwan Lee, Jin Myeong Yang, Sung Won Park
Life of this patent
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Abstract
A power module includes a plurality of first substrates, on each of which a first chip is disposed, a plurality of second substrates disposed to oppose the plurality of first substrates, and a signal lead including a signal pin connected to the first chip. At least a portion of the signal pin extends to a space between each of the first substrates disposed to be adjacent to each other.
Claims15
A power module comprising:
- a plurality of first substrates, on each of which a chip is disposed;
- a second substrate disposed to oppose the plurality of first substrates;
- and
- a signal lead including a signal pin connected to the chip,
- wherein at least a portion of the signal pin extends to a space between each of the plurality of first substrates disposed to be adjacent to each other.
2 more elements
A power module comprising:
- a plurality of first substrates, on each of which a chip is disposed;
- a plurality of second substrates disposed to oppose the plurality of first substrates;
- and
- a signal lead including a signal pin connected to the chip;
- wherein at least a portion of the signal pin extends to a space between each of the plurality of first substrates disposed to be adjacent to each other.
2 more elements
Dependencies are inferred from the claim text.