Semiconductor module
AssigneeFuji Electric Co., Ltd.
InventorTomoya Kishi
Life of this patent
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AssigneeFuji Electric Co., Ltd.
InventorTomoya Kishi
Estimating the term…
A semiconductor module includes semiconductor units arrayed in a line, a first sensing terminal disposed on a first side of the line, and a second sensing terminal disposed on a second side of the line. Each semiconductor unit includes an upper arm circuit, a lower arm circuit, and an insulating substrate including a first conductor pattern. The first sensing terminal is connected to an emitter of a first semiconductor chip included in any one semiconductor unit via a first wiring route including a first sensing conductor pattern provided on the insulating substrate. The second sensing terminal is connected to the emitter of the first semiconductor chip connected to the first sensing terminal, via a second wiring route including a second sensing conductor pattern provided on the insulating substrate separately from the first conductor pattern, without passing via the first conductor pattern.
A semiconductor module comprising:
Dependencies are inferred from the claim text.