H10W 70/654
Top-view layouts
H10W70/654 (Top-view layouts) appears on 5,609 US grants and 5,996 published applications in this corpus.
Search patents in H10W- Granted patents
- 5,609
- Published applications
- 5,996
- Assignees
- 842
- Inventors
- 7,567
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 3 | 0 |
| 1978 | 4 | 0 |
| 1979 | 1 | 0 |
| 1980 | 5 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 3 | 0 |
| 1984 | 1 | 0 |
| 1985 | 3 | 0 |
| 1986 | 3 | 0 |
| 1987 | 5 | 0 |
| 1988 | 7 | 0 |
| 1989 | 10 | 0 |
| 1990 | 6 | 0 |
| 1991 | 18 | 0 |
| 1992 | 13 | 0 |
| 1993 | 18 | 0 |
| 1994 | 27 | 0 |
| 1995 | 25 | 0 |
| 1996 | 22 | 0 |
| 1997 | 44 | 0 |
| 1998 | 53 | 0 |
| 1999 | 83 | 0 |
| 2000 | 90 | 0 |
| 2001 | 108 | 63 |
| 2002 | 152 | 166 |
| 2003 | 140 | 195 |
| 2004 | 171 | 228 |
| 2005 | 190 | 259 |
| 2006 | 136 | 209 |
| 2007 | 157 | 264 |
| 2008 | 180 | 261 |
| 2009 | 167 | 231 |
| 2010 | 188 | 224 |
| 2011 | 214 | 226 |
| 2012 | 195 | 197 |
| 2013 | 229 | 187 |
| 2014 | 202 | 232 |
| 2015 | 223 | 237 |
| 2016 | 234 | 210 |
| 2017 | 226 | 219 |
| 2018 | 217 | 271 |
| 2019 | 262 | 352 |
| 2020 | 309 | 396 |
| 2021 | 273 | 316 |
| 2022 | 243 | 294 |
| 2023 | 251 | 236 |
| 2024 | 222 | 201 |
| 2025 | 192 | 141 |
| 2026 | 83 | 181 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Semiconductor package6 Oct 2026US 12,757,763 B2Samsung Electronics Co., Ltd.
- Stacked chip scale semiconductor device29 Sep 2026US 12,751,326 B2SanDisk Technologies LLC
- Semiconductor package29 Sep 2026US 12,751,330 B2Samsung Electronics Co., Ltd.
- Integrated circuit packages and methods of forming the same22 Sep 2026US 12,745,645 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Apparatus and method for electroless surface finishing on glass15 Sep 2026US 12,740,460 B2Intel Corporation
- Integrated circuit packages and methods of forming the same8 Oct 2026US 2026/0314429 A1Taiwan Semiconductor Manufacturing Company.Ltd
- System-in-package (sip) configured to receive multiple memory dies8 Oct 2026US 2026/0314443 A1QUALCOMM Incorporated
- Flip-chip package with pre-molded leadframe8 Oct 2026US 2026/0314454 A1Navitas Semiconductor Limited
- Semiconductor device, semiconductor module, and vehicle8 Oct 2026US 2026/0314507 A1Rohm Co., Ltd.
- Semiconductor device with advanced pad structure and method for forming same1 Oct 2026US 2026/0302085 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Testing of semiconductor chips with microbumps1,870US 9,372,206 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Fan-out interconnect structure and method for forming same1,030US 9,368,460 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- 3DIC stacking device and method of manufacture962US 9,443,783 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Semiconductor device having a pad array carrier package626US 5,216,278 AMotorola, Inc. · 1993
- Embedded wafer-level bonding approaches616US 8,361,842 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2013