H10W 70/652
Cross-sectional shapes
H10W70/652 (Cross-sectional shapes) appears on 2,527 US grants and 3,464 published applications in this corpus.
Search patents in H10W- Granted patents
- 2,527
- Published applications
- 3,464
- Assignees
- 429
- Inventors
- 4,122
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1998 | 1 | 0 |
| 1999 | 0 | 0 |
| 2000 | 1 | 0 |
| 2001 | 5 | 8 |
| 2002 | 8 | 2 |
| 2003 | 3 | 5 |
| 2004 | 7 | 5 |
| 2005 | 5 | 10 |
| 2006 | 6 | 8 |
| 2007 | 4 | 10 |
| 2008 | 3 | 32 |
| 2009 | 10 | 20 |
| 2010 | 17 | 41 |
| 2011 | 29 | 54 |
| 2012 | 36 | 81 |
| 2013 | 55 | 85 |
| 2014 | 81 | 93 |
| 2015 | 75 | 97 |
| 2016 | 89 | 83 |
| 2017 | 103 | 123 |
| 2018 | 103 | 160 |
| 2019 | 196 | 263 |
| 2020 | 230 | 342 |
| 2021 | 256 | 387 |
| 2022 | 269 | 407 |
| 2023 | 279 | 300 |
| 2024 | 283 | 308 |
| 2025 | 248 | 278 |
| 2026 | 125 | 262 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Method of manufacturing semiconductor packages6 Oct 2026US 12,757,759 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Wafer-level hybrid bonded RF switch with redistribution layer6 Oct 2026US 12,757,792 B2Qorvo US, Inc.
- Multiple plated via arrays of different wire heights on a same substrate6 Oct 2026US RE51,062 E1Adeia Semiconductor Technologies LLC
- Substrate employing core with cavity embedding reduced height electrical device(s), and related integrated circuit (IC) packages and fabrication methods29 Sep 2026US 12,751,306 B2QUALCOMM Incorporated
- Die package structure and method for forming the same29 Sep 2026US 12,751,314 B2Winbond Electronics Corp.
- Method of manufacturing semiconductor device8 Oct 2026US 2026/0314430 A1SK hynix Inc.
- System-in-package (sip) configured to receive multiple memory dies8 Oct 2026US 2026/0314443 A1QUALCOMM Incorporated
- Flip-chip package with pre-molded leadframe8 Oct 2026US 2026/0314454 A1Navitas Semiconductor Limited
- Semiconductor device and methods of manufacture8 Oct 2026US 2026/0314490 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor devices, assemblies, and associated methods8 Oct 2026US 2026/0314491 A1Micron Technology, Inc.
Most cited
By later US patents
- Stacked semiconductor devices and methods of forming same1,870US 9,496,189 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Methods and apparatus of wafer level package for heterogeneous integration technology1,051US 9,111,949 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Fan-out interconnect structure and method for forming same1,030US 9,368,460 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Method for forming chip scale package156US 6,287,893 B1Flip Chip Technologies, L.L.C. · 2001
- Semiconductor device and manufacturing thereof, including a through-hole with a wider intermediate cavity140US 6,667,551 B2Seiko Epson Corporation · 2003