H10W 70/6523
For connecting to pads at different heights at the same side of
Official title: {for connecting to pads at different heights at the same side of the package substrate, interposer or RDL}
H10W70/6523 (For connecting to pads at different heights at the same side of) appears on 234 US grants and 284 published applications in this corpus.
Search patents in H10W- Granted patents
- 234
- Published applications
- 284
- Assignees
- 118
- Inventors
- 553
- Latest grant
- 4 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2002 | 2 | 1 |
| 2003 | 0 | 0 |
| 2004 | 1 | 1 |
| 2005 | 1 | 2 |
| 2006 | 0 | 1 |
| 2007 | 1 | 2 |
| 2008 | 0 | 3 |
| 2009 | 1 | 2 |
| 2010 | 2 | 5 |
| 2011 | 5 | 6 |
| 2012 | 4 | 13 |
| 2013 | 9 | 20 |
| 2014 | 20 | 11 |
| 2015 | 5 | 13 |
| 2016 | 11 | 5 |
| 2017 | 11 | 16 |
| 2018 | 18 | 23 |
| 2019 | 17 | 13 |
| 2020 | 21 | 37 |
| 2021 | 29 | 32 |
| 2022 | 22 | 21 |
| 2023 | 11 | 15 |
| 2024 | 16 | 17 |
| 2025 | 21 | 15 |
| 2026 | 6 | 10 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- High-density microbump arrays with enhanced adhesion and methods of forming the same4 Aug 2026US 12,702,043 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Package structure with bridge die and method of forming the package structure19 May 2026US 12,635,538 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Light-emitting diode including an active layer disposed between a first semiconductor layer and a second semiconductor layer and display device comprising same12 May 2026US 12,628,471 B2Samsung Display Co., Ltd.
- Electronic circuit module5 May 2026US 12,622,299 B2Murata Manufacturing Co., Ltd.
- Semiconductor structure with a bridge embedded therein and method manufacturing the same27 Jan 2026US 12,538,814 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor device and methods of manufacture8 Oct 2026US 2026/0314490 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Light-emitting diode and display device comprising same17 Sep 2026US 2026/0282607 A1Samsung Display Co., Ltd.
- Package structure with bridge die and method of forming the same27 Aug 2026US 2026/0255994 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Integrated circuit23 Jul 2026US 2026/0215317 A1Pragmatic Semiconductor Limited
- Semiconductor structure11 Jun 2026US 2026/0165181 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Fan-out package having a main die and a dummy die, and method of forming77US 10,163,802 B2Taiwan Semicondcutor Manufacturing Company, Ltd. · 2018
- Stacked fan-out semiconductor chip70US 8,878,360 B2Intel Mobile Communications GmbH · 2014
- Package structure and method of forming the same61US 10,037,963 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2018
- Flexible display and method of formation with sacrificial release layer60US 9,318,475 B2LuxVue Technology Corporation · 2016
- Device including two power semiconductor chips and manufacturing thereof54US 9,331,060 B2Infineon Technologies AG · 2016