Fan-out package having a main die and a dummy die, and method of forming
AssigneeTaiwan Semicondcutor Manufacturing Company, Ltd.
InventorsYan-Fu Lin, Chen-Hua Yu, Meng-Tsan Lee, Wei-Cheng Wu, Hsien-Wei Chen
Life of this patent
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Abstract
A method of forming a package and a package are provided. The method includes placing a main die and a dummy die side by side on a carrier substrate. The method also includes forming a molding material along sidewalls of the main die and the dummy die. The method also includes forming a redistribution layer comprising a plurality of vias and conductive lines over the main die and the dummy die, where the plurality of vias and the conductive lines are electrically connected to connectors of the main die. The method also includes removing the carrier substrate.
Claims20
A structure, comprising:
- one or more main dies;
- one or more dummy dies, a dummy die of the one or more dummy dies being positioned beside a main die of the one or more main dies, and the dummy die of the one or more dummy dies comprising a polymer layer disposed over a substrate, the polymer layer defining a surface of the dummy die of the one or more dummy dies;
- molding material extending along sidewalls of the one or more main dies and the one or more dummy dies;
- and
- a plurality of redistribution layers comprising a plurality of vias and a plurality of conductive lines, wherein each of the plurality of redistribution layers is disposed at a same level of the structure, the one or more main dies contact a first surface of the plurality of redistribution layers, and the dummy die of the one or more dummy dies is disposed in a manner that the surface of the dummy die defined by the polymer layer is closest to the first surface of the plurality of redistribution layers, and the polymer layer extends between the substrate and the first surface of the plurality of redistribution layers;
- and
- a plurality of external connectors disposed on a second surface of the plurality of redistribution layers, the first surface and the second surface being opposite surfaces of the plurality of redistribution layers.
A structure, comprising:
- one or more main dies;
- one or more dummy dies, a first dummy die of the one or more dummy dies being positioned beside a main die of the one or more main dies;
- a plurality of through vias, wherein a through via of the plurality of through vias is positioned beside a second dummy die of the one or more dummy dies;
- a molding material extending along sidewalls of the one or more main dies, the one or more dummy dies, and the plurality of through vias;
- and
- a redistribution layer over the one or more main dies and the one or more dummy dies, wherein the redistribution layer comprises a plurality of conductive lines and a plurality of vias, and wherein the plurality of conductive lines are electrically connected to the one or more main dies.
A structure, comprising:
- one or more main dies;
- one or more dummy dies, wherein a dummy die of the one or more dummy dies is positioned beside a main die of the one or more main dies;
- a molding material extending along sidewalls of the one or more main dies and the one or more dummy dies;
- and
- a redistribution layer over the one or more main dies and the one or more dummy dies, wherein the redistribution layer comprises a plurality of conductive lines and a plurality of vias;
- and
- wherein an area of the structure in a plan view of the structure is a first area, an area of the structure covered by the one or more main dies and the one or more dummy dies in the plan view of the structure is a second area, and a ratio of the first area to the second area is 2.5 or less.
Dependencies are inferred from the claim text.