Package structure with bridge die and method of forming the package structure

A method of forming a package structure, comprising:

• providing a wafer having a semiconductor substrate;
• forming first conductive vias in the semiconductor substrate of the wafer;
• planarizing the semiconductor substrate from a backside of the semiconductor substrate;
• recessing the semiconductor substrate to expose the first conductive vias, wherein the first conductive vias protrude from the backside of the semiconductor substrate;
• forming second conductive vias over the first conductive vias to be electrically connected with the first conductive via;
• forming an encapsulant layer over the second conductive vias to encapsulate the second conductive vias;
• performing a singulation process to the wafer cutting through the encapsulant layer and the semiconductor substrate into individual bridge dies, wherein each bridge die includes the first conductive vias penetrating through the semiconductor substrate, the second conductive vias connected with the first conductive vias and a first encapsulant encapsulating the second conductive vias;
• providing a first die and a second die;
• and
• electrically connecting at least one bridge die with the first die and the second die, wherein the first die and the second die are electrically connected through the at least one bridge die.

A package structure, comprising:

• a first die and a second die, disposed side-by-side;
• a bridge die, disposed over the first die and the second die and electrically connected with the first die and the second die, wherein the bridge die electrically connects the first die and the second die, and the bridge die includes:
• a semiconductor substrate;
• first conductive vias, embedded in and penetrating through the semiconductor substrate, wherein portions of the first conductive vias are protruded from the semiconductor substrate;
• an isolation layer, disposed on and in contact with the semiconductor substrate and surrounding the protruded portions of the first conductive vias;
• second conductive vias, disposed directly on and connected to the first conductive vias;
• and
• a first encapsulant encapsulating the second conductive vias.