H10W 70/6525
For securing the interconnections to the substrate
Official title: {for securing the interconnections to the substrate, e.g. to prevent peeling}
H10W70/6525 (For securing the interconnections to the substrate) appears on 150 US grants and 202 published applications in this corpus.
Search patents in H10W- Granted patents
- 150
- Published applications
- 202
- Assignees
- 69
- Inventors
- 405
- Latest grant
- 31 Mar 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2004 | 0 | 1 |
| 2005 | 1 | 1 |
| 2006 | 0 | 2 |
| 2007 | 0 | 0 |
| 2008 | 0 | 10 |
| 2009 | 2 | 4 |
| 2010 | 3 | 9 |
| 2011 | 8 | 9 |
| 2012 | 6 | 18 |
| 2013 | 7 | 12 |
| 2014 | 9 | 7 |
| 2015 | 6 | 9 |
| 2016 | 17 | 14 |
| 2017 | 9 | 15 |
| 2018 | 14 | 13 |
| 2019 | 10 | 8 |
| 2020 | 8 | 12 |
| 2021 | 8 | 8 |
| 2022 | 9 | 18 |
| 2023 | 11 | 16 |
| 2024 | 9 | 5 |
| 2025 | 10 | 6 |
| 2026 | 3 | 5 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Package substrate having porous dielectric layer31 Mar 2026US 12,593,710 B2Texas Instruments Incorporated
- Surface functionalization of sinx thin film by wet etching for improved adhesion of metal-dielectric for HSIO3 Mar 2026US 12,568,817 B2Intel Corporation
- Inorganic redistribution layer on organic substrate in integrated circuit packages17 Feb 2026US 12,557,675 B2Intel Corporation
- Wiring board, semiconductor device, and wiring board manufacturing method30 Dec 2025US 12,513,829 B2Shinko Electric Industries Co., Ltd.
- Electronic device and method of fabricating an electronic device25 Nov 2025US 12,482,778 B2Innolux Corporation
- Package substrate and fabricating method thereof20 Aug 2026US 2026/0248004 A1AaltoSemi Inc.
- Package substrate having porous dielectric layer13 Aug 2026US 2026/0240024 A1
- Flexible pin23 Jul 2026US 2026/0213440 A1Dynex Semiconductor Limited
- Encapsulated semiconductor package21 May 2026US 2026/0144113 A1Nexperia B. V.
- Packaging substrate and manufacturing method thereof12 Mar 2026US 2026/0076239 A1Absolics Inc.
Most cited
By later US patents
- Semiconductor device and method of manufacture41US 10,090,284 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2018
- Semiconductor device and method of manufacture38US 9,859,258 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2018
- Semiconductor device, fabricating method thereof and semiconductor package including the semiconductor device29US 8,592,991 B2Samsung Electronics Co., Ltd. · 2013
- Semiconductor device and method of manufacturing the same24US 6,958,544 B2Shinko Electric Industries Co., Ltd. · 2005
- Wiring substrate and semiconductor device15US 9,875,957 B2Shinko Electric Industries Co., Ltd. · 2018