Flexible pin

A method of manufacturing a pin for use in power semiconductor packaging, the method comprising:

• forming a head shaped to allow a connection to an external connector;
• forming a base comprising a surface suitable for soldering to a substrate of a semiconductor package;
• forming a body connecting the head to the base, the body having a first side and a second side, the second side opposite to the first side;
• wherein the body comprises a rigid portion and a flexible portion, the flexible portion being in proximity to the base;
• forming a first recess in the flexible portion in the first side, the first recess comprising two opposing first horizontal faces;
• forming a second recess in the flexible portion in the second side, the second recess comprising two opposing second horizontal faces, the first and second horizontal faces being parallel to the surface of the base;
• and
• forming an interior cavity in the flexible portion separated from either side, the interior cavity comprising two opposing vertical faces;
• such that the flexible portion is able to flex, allowing for relative motion of the head and the base.