Electronic device and method of fabricating an electronic device

A method of fabricating an independent electronic device from an electronic device having a plurality of element areas and a plurality of non-element areas, the plurality of non-element areas includes scribe lines, the method comprising:

• providing a panel level glass substrate;
• forming a first metal layer only on the plurality of element areas of the panel level glass substrate;
• forming a first insulation layer on the panel level glass substrate of both the plurality of element areas and the plurality of non-element areas;
• patterning the first insulation layer to form a first opening in the plurality of non-element areas;
• forming a second insulation layer on the first insulation layer, wherein the second insulation layer extends to the first opening, and in a cross-sectional view, a width of a lower bottom of the first opening is less than a width of an upper bottom of the first opening;
• and
• patterning the second insulation layer to form a second opening corresponding to the first opening,
• wherein the second opening exposes a portion of a surface of the first insulation layer, the first opening and the second opening expose the panel level glass substrate, a width of a lower bottom of the second opening is less than a width of an upper bottom of the second opening and the width of the lower bottom of the second opening is greater than the width of the upper bottom of the first opening;
• and
• cutting the electronic device along the scribe lines to form the independent electronic device.