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US 12,593,710 B2Granted
Package substrate having porous dielectric layer
AssigneeTexas Instruments Incorporated
InventorsJaimal Mallory Williamson, Jim C. Lo
Life of this patent
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Abstract
A method of making a multilayer package substrate includes forming a plurality of dielectric layers including a top dielectric layer on a top side and a bottom dielectric layer on a bottom side. A top patterned metal layer is on the top dielectric layer and a bottom patterned metal layer is on the bottom dielectric layer. At least one of the top dielectric layer and the bottom dielectric layer is a porous dielectric layer having a plurality of pores including an average porosity of at least 5% averaged over its thickness.
Claims15
A method, comprising:
- forming a multilayer package substrate, comprising:
- forming a core layer;
- forming a top patterned metal layer on a top side of the core layer and a bottom patterned metal layer on a bottom side of the core layer, wherein the top patterned metal layer includes an antenna;
- forming a plurality of dielectric layers including a top dielectric layer on the top patterned metal layer and a bottom dielectric layer on the bottom patterned metal layer, wherein at least one of the plurality of dielectric layers comprises a porous dielectric layer including a plurality of pores;
- and
- mounting an integrated circuit (IC) die comprising a substrate including a top side semiconductor surface including circuitry having a plurality of bond pads on or within the multilayer package substrate, wherein the plurality of bond pads are electrically connected to the multilayer package substrate.
3 more elements
Dependencies are inferred from the claim text.