Inorganic redistribution layer on organic substrate in integrated circuit packages

An integrated circuit (IC) package, comprising:

• a die having a first set of interconnects of a first pitch;
• and
• an interposer comprising a first inorganic layer having a second set of interconnects of a second pitch, an organic substrate over the first inorganic layer, and a second inorganic layer over the organic substrate, wherein:
• the second inorganic layer comprises conductive traces electrically coupling the organic substrate with the first set of interconnects, and
• the die is attached to the interposer by the first set of interconnects.

A package comprising:

• a first inorganic layer comprising a first set of interconnects of a first pitch;
• an organic substrate over the first inorganic layer, the organic substrate comprising a set of vias coupled to the first set of interconnects and arranged at the first pitch;
• a die embedded in the organic substrate;
• a second inorganic layer comprising a second set of interconnects of a second pitch;
• and
• conductive traces electrically coupling the set of vias with the second set of interconnects, wherein the second pitch is different from the first pitch.