Semiconductor device and method of manufacture
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsWei-Yu Chen, Tien-Chung Yang, An-Jhih Su, Hsien-Wei Chen
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Abstract
A semiconductor device and a method of manufacture are provided. In particular, a semiconductor device includes a first set of through vias between and connecting a top package and a redistribution layer (RDL), the first set of through vias in physical contact with a molding compound and separated from a die. The semiconductor device also includes a first interconnect structure between and connecting the top package and the RDL, the first interconnect structure separated from the die and from the first set of through vias by the molding compound. The first interconnect structure includes a second set of through vias and at least one integrated passive device.
Claims20
A semiconductor device comprising:
- a redistribution layer (RDL);
- a die disposed on the RDL;
- a first set of through vias between and connecting a top substrate and the RDL, the first set of through vias in physical contact with a molding compound and separated from the die by the molding compound;
- and
- a first interconnect structure between and connecting the top substrate and the RDL, the first interconnect structure separated from the die and from the first set of through vias by the molding compound, the first interconnect structure comprising:
- at least one passive device;
- and
- a second set of through vias within the first interconnect structure.
A semiconductor device comprising:
- a layer between a package and a redistribution layer (RDL), the layer comprising:
- a semiconductor die, wherein a first side of the semiconductor die is connected to the RDL and a second side of the semiconductor die is attached to a polymer layer;
- at least one first via extending from a first side of the layer to a second side of the layer;
- a first passive device structure, the first passive device structure comprising:
- at least one passive device;
- and
- at least one second via disposed within the first passive device structure
- a second passive device structure, the second passive device structure comprising:
- at least one passive device;
- and
- at least one third via disposed within the second passive device structure;
- a molding compound surrounding the semiconductor die, the at least one first via, the first passive device structure, and the second passive device structure, wherein the first passive device structure is separated from the at least one first via and the second passive device structure by the molding compound, wherein the at least one first via extends from a first side of the molding compound to a second side of the molding compound;
- and
- wherein the at least one first via, the at least one second via, and the at least one third via connect the RDL and the package, wherein the at least one second via and the at least one third via are through substrate vias (TSVs).
A semiconductor device comprising:
- a set of vias disposed on and connected to a redistribution layer (RDL);
- a die disposed on and connected to the RDL, wherein the die is separated from the set of vias by an encapsulant;
- and
- a first interconnect structure disposed on and connected to the RDL, wherein the first interconnect structure is separated from the die and the set of vias by the encapsulant, wherein the encapsulant is in physical contact with the set of vias, the die, and the first interconnect structure, wherein respective top surfaces of the set of vias, the die, the encapsulant, and the first interconnect structure are level, and wherein the first interconnect structure comprises:
- a substrate;
- at least one through conductive element extending from one side of the substrate to a second side of the substrate;
- and
- at least one integrated passive device.
Dependencies are inferred from the claim text.