Encapsulated semiconductor package
AssigneeNexperia B.V.
InventorsAgatino Minotti, Wei Gong
Life of this patent
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Abstract
An encapsulated semiconductor package is proposed, including a plurality of rivets, and a plurality of connection pins, each connection pin having a pin tip and a pin end, the plurality of rivets are disposed in the encapsulant of the encapsulated semiconductor package, each rivet having a first rivet end and a second rivet end, each rivet being electrically mounted with a first rivet end on a corresponding bond pad of the semiconductor package; each rivet includes a rivet cavity configured to receive the pin tip of the connection pin; the pin tip of the connection pin is configured as a press-fit pin tip having an outer diameter larger than an inner diameter of the rivet cavity and configured for friction-based engagement with the rivet cavity.
Claims18
An encapsulated semiconductor package comprising:
- a plurality of rivets and a plurality of connection pins, each connection pin having a pin tip and a pin end,
- wherein the plurality of rivets are disposed in the encapsulant of the encapsulated semiconductor package, each rivet having a first rivet end and a second rivet end, the rivet being electrically mounted with a first rivet end on a corresponding bond pad of the semiconductor package;
- each rivet comprises a rivet cavity configured to receive the pin tip of the connection pin;
- and
- wherein the pin tip of the connection pin is configured as a press-fit pin tip having an outer diameter that is larger than an inner diameter of the rivet cavity and configured for friction-based engagement with the rivet cavity.
Dependencies are inferred from the claim text.