H10W 70/6565
Recessed into the surface of the package substrates, interposers, or redistribution layers
Official title: {recessed into the surface of the package substrates, interposers, or redistribution layers}
H10W70/6565 (Recessed into the surface of the package substrates, interposers, or redistribution layers) appears on 92 US grants and 107 published applications in this corpus.
Search patents in H10W- Granted patents
- 92
- Published applications
- 107
- Assignees
- 39
- Inventors
- 200
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 1 | 0 |
| 2000 | 1 | 0 |
| 2001 | 1 | 1 |
| 2002 | 0 | 1 |
| 2003 | 1 | 0 |
| 2004 | 1 | 0 |
| 2005 | 0 | 1 |
| 2006 | 0 | 1 |
| 2007 | 1 | 1 |
| 2008 | 0 | 6 |
| 2009 | 2 | 3 |
| 2010 | 4 | 4 |
| 2011 | 3 | 3 |
| 2012 | 6 | 7 |
| 2013 | 5 | 5 |
| 2014 | 4 | 3 |
| 2015 | 3 | 5 |
| 2016 | 8 | 8 |
| 2017 | 3 | 7 |
| 2018 | 8 | 7 |
| 2019 | 1 | 3 |
| 2020 | 10 | 8 |
| 2021 | 6 | 4 |
| 2022 | 4 | 9 |
| 2023 | 6 | 4 |
| 2024 | 5 | 6 |
| 2025 | 3 | 1 |
| 2026 | 3 | 9 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Electronic device22 Sep 2026US 12,745,504 B2Innolux Corporation
- Semiconductor package and method of fabricating the same31 Mar 2026US 12,593,702 B2Samsung Electronics Co., Ltd.
- Semiconductor package using flip-chip technology17 Feb 2026US 12,557,215 B2Mediatek Inc.
- Package with a substrate comprising embedded escape interconnects and surface escape interconnects23 Sep 2025US 12,424,559 B2QUALCOMM Incorporated
- Semiconductor packages22 Jul 2025US 12,368,093 B2Samsung Electronics Co., Ltd.
- Wiring substrate and semiconductor device1 Oct 2026US 2026/0305415 A1Shinko Electric Industries Co., Ltd.
- Integrated substrate, manufacturing method thereof and electronic device17 Sep 2026US 2026/0282979 A1Beijing BOE Sensor Technology Co., Ltd.
- Circuit board, and semiconductor package comprising same6 Aug 2026US 2026/0231800 A1LG Innotek Co., Ltd.
- Interposer substrate, package structure including the same, manufacturing method thereof, and electrical system9 Jul 2026US 2026/0198347 A1Shenzhen STS Microelectronics Co., Ltd.
- A wafer-level package and a method for forming the wafer-level package9 Jul 2026US 2026/0198384 A1Agency for Science, Technology and Research
Most cited
By later US patents
- Process for manufacturing printed circuit boards132US 6,004,619 AHewlett-Packard Company · 1999
- Method for the production of printed circuit boards125US 6,035,527 AIngenieurbuero Tamm Factory Innovations · 2000
- Method for reducing capacitive coupling between conductive lines21US 6,570,258 B2Micron Technology, Inc. · 2003
- Embedded metal features structure18US 7,589,398 B1Amkor Technology, Inc. · 2009
- Manufacturing method of substrate structure having embedded interconnection layers15US 9,653,323 B2Advanpack Solutions Pte Ltd. · 2017