Interposer substrate, package structure including the same, manufacturing method thereof, and electrical system

A package structure comprising:

• an interposer substrate, including:
• an insulating body;
• a coupling member on the insulating body;
• and
• a first electronic component in the insulating body and coupled to the coupling member;
• a first mounting substrate including an insulating body, a first conductive layer on a side of the insulating body, and a second conductive layer on an opposing side of the insulating body;
• and
• a power die electrically coupled to a die bonding portion of the conductive layer, the die being between the interposer substrate and the first mounting substrate
• wherein the first electronic component is electrically coupled, through the coupling member to one of:
• the second conductive layer of the first mounting substrate;
• or an electrode of the power die.

A manufacturing method for a package structure comprising:

• providing an interposer substrate comprising:
• providing an insulating body;
• forming one or more holes in the insulating body;
• forming one or more coupling members on the insulating body;
• and
• disposing one or more electronic components,
• wherein the one or more electronic components include a first electronic component in a first hole of the one or more holes, electrically coupled to a corresponding first coupling member of the one or more coupling members, and adaptable to be electrically coupled to other members of the package structure external to the interposer substrate through the first coupling member.