H10W 70/657
On sidewalls or bottom surfaces of the package substrates, interposers or redistribution
Official title: {on sidewalls or bottom surfaces of the package substrates, interposers or redistribution layers}
H10W70/657 (On sidewalls or bottom surfaces of the package substrates, interposers or redistribution) appears on 1,064 US grants and 1,066 published applications in this corpus.
Search patents in H10W- Granted patents
- 1,064
- Published applications
- 1,066
- Assignees
- 369
- Inventors
- 2,142
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 4 | 0 |
| 1983 | 1 | 0 |
| 1984 | 3 | 0 |
| 1985 | 5 | 0 |
| 1986 | 5 | 0 |
| 1987 | 5 | 0 |
| 1988 | 4 | 0 |
| 1989 | 4 | 0 |
| 1990 | 4 | 0 |
| 1991 | 5 | 0 |
| 1992 | 2 | 0 |
| 1993 | 6 | 0 |
| 1994 | 11 | 0 |
| 1995 | 5 | 0 |
| 1996 | 5 | 0 |
| 1997 | 15 | 0 |
| 1998 | 13 | 0 |
| 1999 | 15 | 0 |
| 2000 | 25 | 0 |
| 2001 | 28 | 17 |
| 2002 | 28 | 26 |
| 2003 | 30 | 39 |
| 2004 | 32 | 42 |
| 2005 | 31 | 42 |
| 2006 | 25 | 41 |
| 2007 | 31 | 35 |
| 2008 | 17 | 26 |
| 2009 | 21 | 27 |
| 2010 | 28 | 20 |
| 2011 | 27 | 35 |
| 2012 | 17 | 26 |
| 2013 | 26 | 40 |
| 2014 | 35 | 32 |
| 2015 | 42 | 51 |
| 2016 | 46 | 59 |
| 2017 | 61 | 75 |
| 2018 | 80 | 75 |
| 2019 | 47 | 59 |
| 2020 | 42 | 45 |
| 2021 | 48 | 41 |
| 2022 | 38 | 53 |
| 2023 | 42 | 66 |
| 2024 | 38 | 49 |
| 2025 | 36 | 26 |
| 2026 | 29 | 19 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Semiconductor package and semiconductor package assembly with edge side interconnection29 Sep 2026US 12,751,308 B2Etron Technology, Inc.
- Connector to electrically couple multiple substrates25 Aug 2026US 12,719,185 B2Intel Corporation
- Methods related to dual-sided radio-frequency package with overmold structure25 Aug 2026US 12,721,179 B2Skyworks Solutions, Inc.
- Fan-out packaging structure and manufacturing method thereof18 Aug 2026US 12,713,929 B2Jcet Group Co., Ltd.
- Electronic package with concave lead end faces11 Aug 2026US 12,708,008 B2Texas Instruments Incorporated
- Semiconductor device24 Sep 2026US 2026/0293704 A1Rohm Co., Ltd.
- Semiconductor device17 Sep 2026US 2026/0282980 A1Rohm Co., Ltd.
- Semiconductor package module and method of manufacturing the same10 Sep 2026US 2026/0271774 A1Powertech Technology Inc.
- Heat dissipation package and method of manufacturing the same20 Aug 2026US 2026/0247964 A1Chipbond Technology Corporation
- Semiconductor device and manufacturing method thereof20 Aug 2026US 2026/0247988 A1Kioxia Corporation
Most cited
By later US patents
- Semiconductor chip assemblies with fan-in leads734US 5,148,265 AIST Associates, Inc. · 1992
- Semiconductor chip assemblies having interposer and flexible lead719US 5,148,266 AIST Associates, Inc. · 1992
- Semiconductor chip assemblies, methods of making same and components for same424US 5,679,977 ATessera, Inc. · 1997
- Integrated circuit chip stacking322US 4,956,694 ADense-Pac Microsystems, Inc. · 1990
- Plated plastic castellated interconnect for electrical components301US 5,069,626 AWestern Digital Corporation · 1991