Semiconductor package module and method of manufacturing the same

A method of manufacturing a semiconductor package module comprising:

• providing a holding board ;
• forming at least one first conductive pillar on the holding board;
• disposing at least one first electronic component on the holding board, wherein a first surface of the first electronic component is connected to the holding board;
• after forming the first conductive pillar and disposing the first electronic component, forming a first encapsulation layer on the holding board, wherein the first encapsulation layer encapsulates the first conductive pillar and the first electronic component and exposes a first end surface of the first conductive pillar;
• after forming the first encapsulation layer, disposing a first redistribution layer on the first end surface of the first conductive pillar, wherein the first redistribution layer is electrically connected to the first electronic component, wherein the first conductive pillar has an interface away from the first redistribution layer;
• after disposing the first redistribution layer, removing the holding board to expose the first surface of the first electronic component, and exposing the interface of the first conductive pillar;
• after removing the holding board, forming a second conductive pillar on the interface of the first conductive pillar;
• disposing an adhesive material on a second surface of a second electronic component;
• after forming the second conductive pillar, disposing the second electronic component on the first surface of the first electronic component, so that the first electronic component, the adhesive material, and the second electronic component are stacked on each other in a normal direction of the first redistribution layer, and the adhesive material is located between the first electronic component and the second electronic component;
• after disposing the second electronic component, forming a second encapsulation layer on the first encapsulation layer, wherein the second encapsulation layer encapsulates the second conductive pillar and the second electronic component, and exposes a second end surface of the second conductive pillar;
• and
• after forming the second encapsulation layer, disposing a second redistribution layer on the second end surface of the second conductive pillar, wherein the second redistribution layer is electrically connected to the second electronic component,
• wherein an active surface of the first electronic component and an active surface of the second electronic component face the first redistribution layer and the second redistribution layer respectively.