Heat dissipation package and method of manufacturing the same

A method of manufacturing heat dissipation packages comprising:

• providing a plurality of heat dissipation layers, each of the plurality of heat dissipation layers includes a main portion and a carry portion, the main portion has an outer surface and an inner surface, a first area and a second area are defined on the inner surface, the carry portion protrudes from the first area and exposes the second area;
• providing an uncured thermally conductive material on a carry surface of the carry portion of each of the plurality of heat dissipation layers, wherein the uncured thermally conductive material is restricted to flow within the carry surface;
• bonding a plurality of electronic components to the uncured thermally conductive material on the carry surface of the carry portion of each of the plurality of heat dissipation layers, each of the plurality of electronic components is connected to one of the plurality of heat dissipation layers;
• forming an encapsulant, the plurality of heat dissipation layers and the plurality of electronic components are covered by the encapsulant to become a plurality of heat dissipation packages which are connected to one another, each of the plurality of heat dissipation packages includes one of the plurality of heat dissipation layers and one of the plurality of electronic components;
• and
• cutting the encapsulant to separate the plurality of heat dissipation packages.