Semiconductor device

A semiconductor device comprising:

• a semiconductor element that is a switching element, the semiconductor element having an element obverse surface and an element reverse surface that face away from each other in a thickness direction;
• a first lead on which the semiconductor element is mounted, and that is electrically connected to the semiconductor element;
• a second lead that is spaced apart from the first lead in a first direction perpendicular to the thickness direction, the second lead being electrically connected to the semiconductor element;
• and
• a sealing resin covering a portion of the first lead, a portion of the second lead, and the semiconductor element, wherein
• the sealing resin has a resin reverse surface facing in a same direction as the element reverse surface,
• the resin reverse surface includes a first end portion positioned on a first side in the first direction, a second end portion positioned on a second side in the first direction, a third end portion positioned on one side in a second direction perpendicular to the thickness direction and the first direction, and a fourth end portion positioned on an opposite side in the second direction,
• the first lead is exposed from the first end portion, and is not exposed from any of the second end portion, the third end portion, and the fourth end portion,
• the second lead is exposed from the second end portion, and is not exposed from any of the first end portion, the third end portion, and the fourth end portion,
• the first lead includes:
• a die pad portion on which the semiconductor element is mounted;
• and a first-lead terminal portion connected to the die pad portion on the first side,
• the second lead includes:
• a bonding portion having a bonding portion obverse surface and a bonding portion reverse surface, the bonding portion obverse surface facing in a same direction as the element obverse surface, the bonding portion obverse surface being a surface to which a plurality of wires electrically connected to the semiconductor element are bonded, the bonding portion reverse surface being exposed from the resin reverse surface;
• and a second-lead terminal portion connected to the bonding portion on the second side and exposed from the resin reverse surface, and
• the second lead includes an exposed surface from the resin reverse surface, and an entirety of the exposed surface is rectangular.