H10W 20/2128
Coaxial through-semiconductor vias
Official title: {Coaxial through-semiconductor vias}
H10W20/2128 (Coaxial through-semiconductor vias) appears on 222 US grants and 259 published applications in this corpus.
Search patents in H10W- Granted patents
- 222
- Published applications
- 259
- Assignees
- 90
- Inventors
- 407
- Latest grant
- 9 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2000 | 2 | 0 |
| 2001 | 2 | 1 |
| 2002 | 3 | 4 |
| 2003 | 1 | 2 |
| 2004 | 4 | 3 |
| 2005 | 5 | 4 |
| 2006 | 3 | 25 |
| 2007 | 4 | 15 |
| 2008 | 1 | 5 |
| 2009 | 8 | 6 |
| 2010 | 14 | 18 |
| 2011 | 18 | 21 |
| 2012 | 15 | 19 |
| 2013 | 12 | 18 |
| 2014 | 21 | 19 |
| 2015 | 21 | 16 |
| 2016 | 15 | 10 |
| 2017 | 16 | 13 |
| 2018 | 12 | 12 |
| 2019 | 12 | 7 |
| 2020 | 5 | 6 |
| 2021 | 9 | 6 |
| 2022 | 1 | 4 |
| 2023 | 4 | 8 |
| 2024 | 7 | 6 |
| 2025 | 4 | 5 |
| 2026 | 3 | 6 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Semiconductor device with through hole electrode wiring9 Jun 2026US 12,653,012 B2Sony Semiconductor Solutions Corporation
- High density three-dimensional integrated capacitors5 May 2026US 12,622,003 B2Adeia Semiconductor Solutions LLC
- Semiconductor structure and forming method thereof7 Apr 2026US 12,598,985 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor structure with an air gap, method for forming same, and stacked structure16 Sep 2025US 12,417,984 B2Changxin Memory Technologies, Inc.
- Semiconductor device, method of manufacturing a semiconductor device, solid-state imaging device, and electronic apparatus19 Aug 2025US 12,396,278 B2Sony Group Corporation
- Backside Deep Trench Capacitor and Inductor Structures30 Jul 2026US 2026/0223667 A1Murata Manufacturing Co., Ltd.
- Conveying radio frequency signals through an interposer30 Jul 2026US 2026/0223686 A1NXP USA, Inc.
- Static random-access memory array, memory, and electronic device16 Jul 2026US 2026/0206566 A1Huawei Technologies Co., Ltd.
- Semiconductor structure9 Jul 2026US 2026/0198305 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Nonvolatile memory device and electronic system including the same4 Jun 2026US 2026/0157164 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- High density chip carrier with integrated passive devices321US 7,030,481 B2Internation Business Machines Corporation · 2006
- High density chip carrier with integrated passive devices303US 6,962,872 B2International Business Machines Corporation · 2005
- Chip spanning connection192US 7,521,806 B22009
- Semiconductor structures having multiple conductive layers in an opening, and methods for fabricating same138US 6,498,381 B2Tru-Si Technologies, Inc. · 2002
- Through-chip conductors for low inductance chip-to-chip integration and off-chip connections98US 6,410,431 B1International Business Machines Corporation · 2002