H10W 20/212
Top-view shapes or dispositions
Official title: {Top-view shapes or dispositions, e.g. top-view layouts of the vias}
H10W20/212 (Top-view shapes or dispositions) appears on 1,826 US grants and 2,338 published applications in this corpus.
Search patents in H10W- Granted patents
- 1,826
- Published applications
- 2,338
- Assignees
- 349
- Inventors
- 3,030
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 2 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 2 | 0 |
| 1995 | 2 | 0 |
| 1996 | 3 | 0 |
| 1997 | 1 | 0 |
| 1998 | 3 | 0 |
| 1999 | 4 | 0 |
| 2000 | 7 | 0 |
| 2001 | 11 | 5 |
| 2002 | 18 | 17 |
| 2003 | 11 | 12 |
| 2004 | 18 | 27 |
| 2005 | 17 | 32 |
| 2006 | 22 | 58 |
| 2007 | 15 | 45 |
| 2008 | 19 | 53 |
| 2009 | 41 | 63 |
| 2010 | 54 | 96 |
| 2011 | 66 | 119 |
| 2012 | 94 | 147 |
| 2013 | 121 | 117 |
| 2014 | 139 | 127 |
| 2015 | 112 | 136 |
| 2016 | 149 | 85 |
| 2017 | 114 | 100 |
| 2018 | 100 | 82 |
| 2019 | 79 | 79 |
| 2020 | 72 | 102 |
| 2021 | 79 | 99 |
| 2022 | 82 | 144 |
| 2023 | 108 | 159 |
| 2024 | 105 | 162 |
| 2025 | 99 | 119 |
| 2026 | 53 | 153 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Semiconductor device25 Aug 2026US 12,720,802 B2Samsung Electronics Co., Ltd.
- Through-substrate-via in photosensitive module25 Aug 2026US 12,720,900 B2Semiconductor Components Industries, LLC
- Semiconductor structures with through via25 Aug 2026US 12,721,138 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor package including a plurality of semiconductor chips in a stacked structure25 Aug 2026US 12,721,228 B2Samsung Electronics Co., Ltd.
- Integrated circuit device18 Aug 2026US 12,713,654 B2Samsung Electronics Co., Ltd.
- Semiconductor structures with through via8 Oct 2026US 2026/0314366 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Low resistance structures in systems8 Oct 2026US 2026/0314467 A1Micron Technology, Inc.
- Dual Guard Ring Design for Through Via17 Sep 2026US 2026/0282871 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor device27 Aug 2026US 2026/0255951 A1Socionext Inc.
- Mdip semiconductor device including backfilled vias13 Aug 2026US 2026/0239949 A1SanDisk Technologies LLC
Most cited
By later US patents
- Method for making three dimensional circuit integration485US 5,998,292 AInternational Business Machines Corporation · 1999
- Three-dimensional multi-chip package having chip selection pads and manufacturing method thereof346US 6,448,661 B1Samsung Electornics Co., Ltd. · 2002
- Integrated circuits and methods for their fabrication341US 6,664,129 B2Tri-Si Technologies, Inc. · 2003
- Electrical package for LSI devices and assembly process therefor334US 4,074,342 AInternational Business Machines Corporation · 1978
- System-in packages334US 8,503,186 B2Megica Corporation · 2013