H10W 20/2125
Top-view shapes
Official title: {Top-view shapes}
H10W20/2125 (Top-view shapes) appears on 1,416 US grants and 1,707 published applications in this corpus.
Search patents in H10W- Granted patents
- 1,416
- Published applications
- 1,707
- Assignees
- 291
- Inventors
- 2,248
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 2 | 0 |
| 1995 | 2 | 0 |
| 1996 | 3 | 0 |
| 1997 | 1 | 0 |
| 1998 | 3 | 0 |
| 1999 | 4 | 0 |
| 2000 | 6 | 0 |
| 2001 | 10 | 5 |
| 2002 | 15 | 13 |
| 2003 | 9 | 10 |
| 2004 | 16 | 21 |
| 2005 | 15 | 30 |
| 2006 | 17 | 52 |
| 2007 | 14 | 43 |
| 2008 | 18 | 45 |
| 2009 | 37 | 58 |
| 2010 | 51 | 77 |
| 2011 | 62 | 97 |
| 2012 | 70 | 115 |
| 2013 | 91 | 78 |
| 2014 | 110 | 92 |
| 2015 | 82 | 104 |
| 2016 | 106 | 63 |
| 2017 | 84 | 75 |
| 2018 | 76 | 65 |
| 2019 | 62 | 66 |
| 2020 | 56 | 81 |
| 2021 | 66 | 78 |
| 2022 | 63 | 101 |
| 2023 | 83 | 116 |
| 2024 | 69 | 108 |
| 2025 | 70 | 74 |
| 2026 | 38 | 40 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Semiconductor device25 Aug 2026US 12,720,802 B2Samsung Electronics Co., Ltd.
- Through-substrate-via in photosensitive module25 Aug 2026US 12,720,900 B2Semiconductor Components Industries, LLC
- Semiconductor structures with through via25 Aug 2026US 12,721,138 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Integrated circuit device18 Aug 2026US 12,713,654 B2Samsung Electronics Co., Ltd.
- Semiconductor device and method for fabricating the same4 Aug 2026US 12,701,985 B2Samsung Electronics Co., Ltd.
- Semiconductor structures with through via8 Oct 2026US 2026/0314366 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Dual Guard Ring Design for Through Via17 Sep 2026US 2026/0282871 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor device27 Aug 2026US 2026/0255951 A1Socionext Inc.
- Backside Deep Trench Capacitor and Inductor Structures30 Jul 2026US 2026/0223667 A1Murata Manufacturing Co., Ltd.
- Conveying radio frequency signals through an interposer30 Jul 2026US 2026/0223686 A1NXP USA, Inc.
Most cited
By later US patents
- Method for making three dimensional circuit integration485US 5,998,292 AInternational Business Machines Corporation · 1999
- Integrated circuits and methods for their fabrication341US 6,664,129 B2Tri-Si Technologies, Inc. · 2003
- Electrical package for LSI devices and assembly process therefor334US 4,074,342 AInternational Business Machines Corporation · 1978
- System-in packages334US 8,503,186 B2Megica Corporation · 2013
- Integrated circuit structures with a conductor formed in a through hole in a semiconductor substrate and protruding from a surface of the substrate327US 6,882,030 B2Tru-Si Technologies, Inc. · 2005