Chip spanning connection
OwnerJohn Trezzainventor
Life of this patent
Estimating the term…
Abstract
A system has a first chip having first semiconductor devices and first electrical connections, a second chip having second semiconductor devices and second electrical connections, and a third chip having third semiconductor devices and third electrical connections, the third chip being stacked on top of and physically spanning at least a portion of each of the first and second chips and being connected to the first and second chips.
Claims20
A system comprising:
- a first chip having first semiconductor devices and first electrical connections thereon;
- a second chip having second semiconductor devices and second electrical connections thereon;
- and
- a third chip having third semiconductor devices and third electrical connections thereon,
- wherein at least one of the first, second, or third electrical connections comprise a post portion that is rigid, and at least another one of the first, second, or third electrical connections comprise a malleable metal portion that is malleable compared to the post portion, wherein the post portions are configured to penetrate into the corresponding malleable metal portions to form malleable and rigid connection, and
- wherein the third chip is disposed at an elevation above the first and second chips, and is separated from the first and second chips by a non-conductive planarizing layer deposited on the first and second chips, and wherein the third chip is coupled to the first and second chips such that at least some of the third electrical connections are coupled to at least some of the first electrical connections and at least one or more others of the third electrical connections are coupled to some of the second electrical connections through joints formed by the post portions and the corresponding malleable metal portions.
A method for coupling a first chip, a second chip, and a third chip, each chip having semiconductor devices and electrical connections thereon, wherein one or more of the electrical connections each comprise a post portion that is rigid, and another one or more of the electrical connections each comprise a malleable metal portion that is malleable compared to the post portion, wherein the first and second chips are separated by a lateral distance, and wherein the third chip is separated from the first and second chips by a non-conductive planarizing layer deposited on the first and second chips, the method comprising:
- disposing the third chip at an elevation above the first and second chips;
- and
- coupling the third chip to the first and second chips by penetrating at least one or more of the post portions into corresponding one or more malleable metal portions to form joints that are malleable and rigid connections, wherein at least some of the electrical connections of the third chip are coupled to at least some of the electrical connections of the first chip, and at least one or more others of the electrical connections of the third chip are coupled to some of the electrical connections of the second chip through the joints.
Dependencies are inferred from the claim text.