H10P 90/12
Preparing bulk and homogeneous wafers
Official title: {Preparing bulk and homogeneous wafers}
H10P90/12 (Preparing bulk and homogeneous wafers) appears on 1,883 US grants and 2,275 published applications in this corpus.
Search patents in H10P- Granted patents
- 1,883
- Published applications
- 2,275
- Assignees
- 630
- Inventors
- 4,182
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 2 | 0 |
| 1978 | 6 | 0 |
| 1979 | 4 | 0 |
| 1980 | 1 | 0 |
| 1981 | 3 | 0 |
| 1982 | 4 | 0 |
| 1983 | 2 | 0 |
| 1984 | 3 | 0 |
| 1985 | 3 | 0 |
| 1986 | 5 | 0 |
| 1987 | 3 | 0 |
| 1988 | 3 | 0 |
| 1989 | 8 | 0 |
| 1990 | 6 | 0 |
| 1991 | 11 | 0 |
| 1992 | 12 | 0 |
| 1993 | 7 | 0 |
| 1994 | 9 | 0 |
| 1995 | 14 | 0 |
| 1996 | 6 | 0 |
| 1997 | 9 | 0 |
| 1998 | 22 | 0 |
| 1999 | 45 | 0 |
| 2000 | 29 | 0 |
| 2001 | 46 | 27 |
| 2002 | 39 | 36 |
| 2003 | 26 | 32 |
| 2004 | 18 | 36 |
| 2005 | 22 | 43 |
| 2006 | 25 | 49 |
| 2007 | 28 | 59 |
| 2008 | 27 | 64 |
| 2009 | 22 | 75 |
| 2010 | 42 | 68 |
| 2011 | 37 | 67 |
| 2012 | 46 | 51 |
| 2013 | 58 | 80 |
| 2014 | 65 | 94 |
| 2015 | 75 | 112 |
| 2016 | 88 | 97 |
| 2017 | 77 | 127 |
| 2018 | 120 | 141 |
| 2019 | 121 | 134 |
| 2020 | 104 | 153 |
| 2021 | 113 | 134 |
| 2022 | 94 | 167 |
| 2023 | 84 | 127 |
| 2024 | 122 | 116 |
| 2025 | 108 | 104 |
| 2026 | 56 | 82 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H10P 90/129By polishing529
- H10P 90/126By chemical etching371
- H10P 90/123By grinding or lapping272
- H10P 90/128By edge treatment241
- H10P 90/18By shaping130
- H10P 90/124By processing the backside of the wafers123
- H10P 90/16By reclaiming or re-processing123
- H10P 90/15By making porous regions on the surface61
All 9 subgroupsShow fewer
Recent patents
- Indium phosphide substrate, method for manufacturing indium phosphide substrate, and semiconductor epitaxial wafer6 Oct 2026US 12,753,529 B2JX Advanced Metals Corporation
- Method for producing a detachment region in a solid-state body22 Sep 2026US 12,741,341 B2Siltectra GmbH
- Method of cleaning silicon wafer, method of manufacturing silicon wafer, and silicon wafer22 Sep 2026US 12,745,582 B2Shin-Etsu Handotai Co., Ltd.
- Indium phosphide substrate and method for producing indium phosphide substrate15 Sep 2026US 12,740,431 B2JX Advanced Metals Corporation
- Semiconductor wafer processing apparatus and method of manufacturing semiconductor element8 Sep 2026US 12,733,461 B2Denso Corporation
- Sic wafer and sic epitaxial wafer8 Oct 2026US 2026/0313999 A1Resonac Corporation
- Substrate production method and chip production method8 Oct 2026US 2026/0314344 A1Disco Corporation
- Wafer processing method and device chip manufacturing method1 Oct 2026US 2026/0305271 A1Disco Corporation
- Bow compensation of semiconductor substrate using plasma jet24 Sep 2026US 2026/0293619 A1Lam Research Corporation
- Method for manufacturing epitaxial wafer24 Sep 2026US 2026/0293620 A1Kabushiki Kaisha Toshiba
Most cited
By later US patents
- Workpiece holder for polishing operation602US 4,512,113 A1985
- Method for filling recesses using pre-treatment with hydrocarbon-containing gas524US 9,117,657 B2ASM IP Holding B. V. · 2015
- Process for surface treatment519US 4,857,137 AHitachi, Ltd. · 1989
- Method for producing semiconductor substrate513US 5,854,123 ACanon Kabushiki Kaisha · 1998
- Process for the manufacture of thin films of semiconductor material430US 5,714,395 ACommissariat A L' Energie Atomique · 1998