H10P 90/18
By shaping
Official title: {by shaping}
H10P90/18 (By shaping) appears on 130 US grants and 159 published applications in this corpus.
Search patents in H10P- Granted patents
- 130
- Published applications
- 159
- Assignees
- 91
- Inventors
- 329
- Latest grant
- 16 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 2 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 2 | 0 |
| 2001 | 0 | 0 |
| 2002 | 1 | 0 |
| 2003 | 0 | 2 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 2 | 1 |
| 2007 | 2 | 3 |
| 2008 | 1 | 2 |
| 2009 | 1 | 3 |
| 2010 | 1 | 3 |
| 2011 | 2 | 3 |
| 2012 | 1 | 2 |
| 2013 | 3 | 4 |
| 2014 | 8 | 7 |
| 2015 | 4 | 8 |
| 2016 | 4 | 8 |
| 2017 | 12 | 24 |
| 2018 | 20 | 12 |
| 2019 | 12 | 17 |
| 2020 | 13 | 6 |
| 2021 | 8 | 12 |
| 2022 | 3 | 11 |
| 2023 | 5 | 8 |
| 2024 | 8 | 11 |
| 2025 | 9 | 7 |
| 2026 | 4 | 5 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Method for wafer treatment27 Jan 2026US 12,538,764 B2Hua Hsu Advanced Technology Co., Ltd.
- Lamination wafers and method of producing bonded wafers using the same2 Dec 2025US 12,488,979 B2Globalwafers Japan Co., Ltd.
- Method for manufacturing epitaxial wafer24 Sep 2026US 2026/0293620 A1Kabushiki Kaisha Toshiba
- Monocrystalline SiC Substrates Having an Asymmetrical Geometry and Method of Producing Same27 Aug 2026US 2026/0255640 A1SiCrystal GmbH
- Laser-assisted method for parting crystalline material6 Aug 2026US 2026/0225180 A1Wolfspeed, Inc.
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- Wafer manufacturing method, laser processing apparatus, and wafer manufacturing apparatus8 Jan 2026US 2026/0008133 A1Disco Corporation
Most cited
By later US patents
- Laser cutting of semiconductor materials96US 6,376,797 B1ASE Americas, Inc. · 2002
- Wafer of semiconductors38US 4,630,093 ASumitomo Electric Industries, Ltd. · 1986
- Self-supported ultra thin silicon wafer process31US 6,162,702 AIntersil Corporation · 2000
- Laser-assisted method for parting crystalline material24US 10,562,130 B1Cree, Inc. · 2020
- Method for manufacturing semiconductor power device16US 7,148,125 B2Denso Corporation · 2006