Method for filling recesses using pre-treatment with hydrocarbon-containing gas
AssigneeASM IP Holding B.V.
InventorsAkinori Nakano, Shintaro Ueda
Life of this patent
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Abstract
A method for filling recesses of a substrate with an insulation film includes: (i) exposing surfaces of the recesses of the substrate to a pre-deposition gas in a reactive state in a reaction space to treat the surfaces with reactive hydrocarbons generated from the pre-deposition gas without filling the recesses; and (ii) depositing a flowable insulation film using a process gas other than the pre-deposition gas on a surface of the substrate to fill the recesses treated in step (i) therewith by plasma reaction. The pre-deposition gas has at least one hydrocarbon unit in its molecule.
Claims17
A method for filling recesses of a substrate with an insulation film, comprising:
- (i) exposing surfaces of the recesses of the substrate to a pre-deposition gas in a reactive state in a reaction space to treat the surfaces with reactive hydrocarbons generated from the pre-deposition gas without filling the recesses, said pre-deposition gas being a hydrocarbon consisting of C and H but exclusive of methane, ethane, propane, ethylene, acetylene, and hexamethyldisilazane, said pre-deposition gas being excited by applying RF power to the reaction space under a pressure of about 100 Pa to about 1,200 Pa, whereby the surface of the recesses is rendered hydrophobic, having a water contact angle of more than 80° but less than 100°;
- and
- (ii) depositing a flowable insulation film using a process gas other than the pre-deposition gas on a surface of the substrate to fill the recesses treated in step (i) therewith by plasma reaction.
Dependencies are inferred from the claim text.