H10P 90/123
By grinding or lapping
Official title: {by grinding or lapping}
H10P90/123 (By grinding or lapping) appears on 272 US grants and 361 published applications in this corpus.
Search patents in H10P- Granted patents
- 272
- Published applications
- 361
- Assignees
- 147
- Inventors
- 763
- Latest grant
- 1 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 3 | 0 |
| 1990 | 3 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 3 | 0 |
| 1999 | 3 | 0 |
| 2000 | 3 | 0 |
| 2001 | 6 | 6 |
| 2002 | 3 | 3 |
| 2003 | 2 | 1 |
| 2004 | 0 | 0 |
| 2005 | 1 | 4 |
| 2006 | 2 | 2 |
| 2007 | 1 | 1 |
| 2008 | 1 | 6 |
| 2009 | 1 | 7 |
| 2010 | 3 | 4 |
| 2011 | 4 | 9 |
| 2012 | 4 | 7 |
| 2013 | 8 | 5 |
| 2014 | 8 | 11 |
| 2015 | 9 | 21 |
| 2016 | 15 | 12 |
| 2017 | 13 | 17 |
| 2018 | 19 | 23 |
| 2019 | 14 | 25 |
| 2020 | 16 | 34 |
| 2021 | 28 | 36 |
| 2022 | 20 | 32 |
| 2023 | 22 | 14 |
| 2024 | 24 | 25 |
| 2025 | 20 | 27 |
| 2026 | 9 | 29 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Processing method of wafer1 Sep 2026US 12,727,445 B2Disco Corporation
- Method for wafer backside polishing26 May 2026US 12,636,749 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Laser-assisted method for parting crystalline material7 Apr 2026US 12,594,622 B2Wolfspeed, Inc.
- Semiconductor device and method of forming same7 Apr 2026US 12,598,995 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Polishing pads and systems for and methods of using same31 Mar 2026US 12,589,463 B23M Innovative Properties Company
- Substrate production method and chip production method8 Oct 2026US 2026/0314344 A1Disco Corporation
- Method for manufacturing epitaxial wafer24 Sep 2026US 2026/0293620 A1Kabushiki Kaisha Toshiba
- Semiconductor wafer and device including impurity adsorption layer27 Aug 2026US 2026/0255896 A1SK keyfoundry Inc.
- Monocrystalline silicon wafer and forming method therefor20 Aug 2026US 2026/0247932 A1Shanghai Institute of Microsystem and Info. Tech., Chinese Academy of Sciences
- Square silicon substrate and manufacturing method therefor13 Aug 2026US 2026/0239934 A1Mitsubishi Materials Corporation
Most cited
By later US patents
- Workpiece holder for polishing operation602US 4,512,113 A1985
- Method of manufacturing a semiconductor device including removing a relief layer from back surface of semiconductor chip229US 9,646,856 B2Intel Deutschland GmbH · 2017
- Chip with encapsulated sides and exposed surface125US 9,064,883 B2Intel Mobile Communications GmbH · 2015
- Method of manufacturing semiconductor wafers95US 5,942,445 AShin-Etsu Handotai Co., Ltd. · 1999
- Apparatus for lapping or polishing materials54US 4,165,584 AInternational Telephone and Telegraph Corporation · 1979