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US 4,165,584 AGranted
Apparatus for lapping or polishing materials
AssigneeInternational Telephone and Telegraph Corporation
InventorRaymond E. Scherrer
Life of this patent
Estimating the term…
Abstract
Wafers to be processed are mounted to a lapping plate of a lapping machine using a photosensitive thermoplastic material, such as a photoresist. In a preferred embodiment, the wafers are laminated to a dry film photopolymer disposed on a carrier sheet, after which the sheet is secured to the lapping plate using a pressed-fit hoop that stretches the carrier sheet across the surface of the lapping plate and holds the sheet secure about the perimeter of the plate.
Claims7
A lapping plate for mounting semiconductor wafers in a lapping machine, comprising:
- a body having a substantially flat upper surface;
- receiving means formed about the periphery of said body for receiving a retaining means;
- retaining means for cooperating with the receiving means for securing a carrier sheet between the retaining means and the receiving means;
- threaded adjusting means extending upwardly from the upper surface of said body for adjusting the thickness of the semiconductor wafers;
- a circular recessed surface formed about said adjusting means;
- and
- plug means for insertion into said recessed surface for engaging edges of openings formed in the carrier sheet and securing said edges to the body at said recessed surfaces.
4 more elements
Dependencies are inferred from the claim text.