Method of manufacturing a semiconductor device including removing a relief layer from back surface of semiconductor chip

A method of manufacturing a device, the method comprising:

• providing a first semiconductor chip having a first face and a second face opposite to the first face, wherein a contact pad is arranged on the first face;
• placing the first semiconductor chip on a carrier;
• after placing the first semiconductor chip on the carrier, encapsulating the first semiconductor chip with an encapsulation material to create an encapsulation body, such that the second face is covered by the encapsulation material;
• removing the carrier;
• and
• after removing the carrier, removing semiconductor material from the second face to create a new second face and removing encapsulation material from the encapsulation body to create a planar back surface of the encapsulation body that includes the new second face and a top face of the encapsulation material surrounding the second face;
• removing an entire top layer of semiconductor material from the new second face to create a final second face that has an outer edge region, wherein an entirety of the final second face, including the outer edge region, is recessed with respect to the top face of the encapsulation material.