Polishing pads and systems for and methods of using same

A polishing pad comprising:

• a textured polishing layer comprising a working surface and a second surface opposite the working surface;
• wherein the textured polishing layer comprises a polymeric blend comprising thermoplastic urethane in an amount of between 40 and 95 wt. %, and styrenic copolymer in an amount of between 5 and 60 wt. %, based on the total weight of the textured polishing layer;
• wherein the styrenic polymers exist in separate domains from the thermoplastic urethanes, such that the glass transition temperature of the thermoplastic urethanes and the glass transition of the styrenic polymer are both present in the polymeric blend, wherein the glass transition temperature of the thermoplastic urethanes is below 25 degrees C. and the glass transition temperature of the styrenic polymers is above 60 degrees C.