Wafer processing method and device chip manufacturing method
AssigneeDisco Corporation
InventorsKokichi MINATO, Koichi MAKINO
Life of this patent
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Abstract
A wafer processing method includes chamfer removing at least a part of a chamfer of a first wafer in annular shape along an outer periphery of the first wafer; bonding a first face of the first wafer with a second wafer; grinding the second face of the first wafer by using a grinding wheel which includes grinding stones arranged annularly, after the chamfer removing and the bonding; corner processing of processing, after the grinding, a corner of the outer peripheral end of the first wafer on the second face side ground in the grinding, such that thickness thereof gradually decreases outward in a diameter direction; and resin layer forming by applying liquid resin onto the second face of the first wafer, after the corner processing.
Claims13
A wafer processing method for processing a first wafer which includes a first face and a second face on an opposite side to the first face, and in which a chamfer is formed on an outer peripheral end, the method comprising:
- chamfer removing at least a part of the chamfer of the first wafer in annular shape along an outer periphery of the first wafer;
- bonding the first face of the first wafer with a second wafer;
- grinding the second face of the first wafer by using a grinding wheel which includes grinding stones arranged annularly, after the chamfer removing and the bonding;
- corner processing of processing, after the grinding, a corner of the outer peripheral end of the first wafer on the second face side ground in the grinding, such that thickness thereof gradually decreases outward in a diameter direction;
- and
- resin layer forming by applying liquid resin onto the second face of the first wafer, after the corner processing.
A device chip manufacturing method, comprising:
- chamfer removing at least a part of a chamfer of a first wafer in annular shape along an outer periphery of the first wafer, the first wafer including a first face on which a device is formed in each of a plurality of regions demarcated by a plurality of division lines, and a second face on an opposite side to the first face, and the chamfer being formed on an outer peripheral end of the first wafer;
- bonding the first face of the first wafer with a second wafer;
- grinding the second face of the first wafer by using a grinding wheel which includes grinding stones arranged annularly, after the chamfer removing and the bonding;
- corner processing of processing, after the grinding, a corner of an outer peripheral end of the first wafer on the second face side ground in the grinding, such that thickness thereof gradually decreases outward in a diameter direction;
- resin layer forming by applying liquid resin onto the second face of the first wafer, after the corner processing;
- and
- manufacturing device chips by dividing the first wafer and the second wafer along the division lines on the first wafer, after the resin layer forming.
Dependencies are inferred from the claim text.