C23C 16/45563
Gas nozzles
Official title: {Gas nozzles}
C23C16/45563 (Gas nozzles) appears on 3,305 US grants and 4,704 published applications in this corpus.
Search patents in C23C- Granted patents
- 3,305
- Published applications
- 4,704
- Assignees
- 822
- Inventors
- 7,647
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 4 | 0 |
| 1979 | 0 | 0 |
| 1980 | 3 | 0 |
| 1981 | 4 | 0 |
| 1982 | 7 | 0 |
| 1983 | 1 | 0 |
| 1984 | 4 | 0 |
| 1985 | 6 | 0 |
| 1986 | 6 | 0 |
| 1987 | 6 | 0 |
| 1988 | 7 | 0 |
| 1989 | 11 | 0 |
| 1990 | 8 | 0 |
| 1991 | 19 | 0 |
| 1992 | 16 | 0 |
| 1993 | 9 | 0 |
| 1994 | 19 | 0 |
| 1995 | 32 | 0 |
| 1996 | 28 | 0 |
| 1997 | 32 | 0 |
| 1998 | 44 | 0 |
| 1999 | 48 | 0 |
| 2000 | 95 | 0 |
| 2001 | 72 | 39 |
| 2002 | 86 | 95 |
| 2003 | 56 | 110 |
| 2004 | 57 | 117 |
| 2005 | 56 | 131 |
| 2006 | 35 | 104 |
| 2007 | 27 | 116 |
| 2008 | 42 | 121 |
| 2009 | 34 | 160 |
| 2010 | 75 | 145 |
| 2011 | 76 | 179 |
| 2012 | 88 | 180 |
| 2013 | 88 | 156 |
| 2014 | 114 | 156 |
| 2015 | 133 | 191 |
| 2016 | 120 | 215 |
| 2017 | 117 | 198 |
| 2018 | 120 | 247 |
| 2019 | 185 | 267 |
| 2020 | 202 | 255 |
| 2021 | 195 | 233 |
| 2022 | 201 | 305 |
| 2023 | 178 | 293 |
| 2024 | 200 | 255 |
| 2025 | 191 | 245 |
| 2026 | 147 | 191 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Injectors, liners, process kits, processing chambers, and related methods for gas flow in batch processing of semiconductor manufacturing6 Oct 2026US 12,753,500 B2APPLIED Materials.Inc.
- Substrate processing apparatus and substrate processing method6 Oct 2026US 12,753,501 B2Tokyo Electron Limited
- Shower head, electrode unit, gas supply unit, substrate processing apparatus, and substrate processing system6 Oct 2026US 12,753,502 B2Tokyo Electron Limited
- Semiconductor process chamber6 Oct 2026US 12,753,503 B2Hanwha Precision Machinery Co., Ltd.
- Film forming apparatus6 Oct 2026US 12,753,504 B2Tokyo Electron Limited
- Reactant vapor delivery systems for semiconductor processing tools and methods8 Oct 2026US 2026/0308757 A1ASM IP Holding B. V.
- Device and method for mist chemical vapor deposition of large-size semiconductor thin film8 Oct 2026US 2026/0308759 A1Tiangong University
- Tombstone structure systems and methods8 Oct 2026US 2026/0308764 A1ASM IP Holding B. V.
- Integration of vapor deposition process into plasma etch reactor8 Oct 2026US 2026/0311972 A1Lam Research Corporation
- Method, assembly and kit for transporting a gas distribution device1 Oct 2026US 2026/0296731 A1ASM IP Holding B. V.
Most cited
By later US patents
- Dual gas faceplate for a showerhead in a semiconductor wafer processing system962US 6,086,677 AAPPLIED Materials.Inc. · 2000
- Shower head and film forming apparatus using the same883US 5,595,606 ATokyo Electron Limited · 1997
- One-piece dual gas faceplate for a showerhead in a semiconductor wafer processing system864US 6,302,964 B1APPLIED Materials.Inc. · 2001
- Gas introduction showerhead for an RTP chamber with upper and lower transparent plates and gas flow therebetween832US 5,781,693 AAPPLIED Materials.Inc. · 1998
- Thermal CVD/PECVD reactor and use for thermal chemical vapor deposition of silicon dioxide and in-situ multi-step planarized process777US 5,000,113 AAPPLIED Materials.Inc. · 1991