Substrate processing apparatus and substrate processing method

A substrate processing apparatus for performing a substrate processing on a surface of a substrate, comprising:

• a processing chamber having an internal space configured to accommodate the substrate;
• a substrate holder configured to hold the substrate in the internal space and rotate the substrate;
• a first nozzle mechanism swingably provided in the internal space and configured to discharge a first processing gas to the substrate held by the substrate holder when the first nozzle mechanism swings;
• a second nozzle mechanism swingably provided in the internal space, separately from the first nozzle mechanism, and configured to discharge a second processing gas to the substrate held by the substrate holder when the second nozzle mechanism swings;
• and
• a controller configured to control the substrate holder, the first nozzle mechanism, and the second nozzle mechanism, wherein:
• the first nozzle mechanism includes a first nozzle extending in the internal space, a first nozzle operating device provided at a base end of the first nozzle and configured to swing the first nozzle, and a first head provided at a tip end of the first nozzle and configured to discharge the first processing gas,
• the second nozzle mechanism includes a second nozzle extending in the internal space, a second nozzle operating device provided at a base end of the second nozzle and configured to swing the second nozzle, and a second head provided at a tip end of the second nozzle and configured to discharge the second processing gas,
• the first nozzle and the second nozzle are provided at a common height position above the surface of the substrate held by the substrate holder,
• the first nozzle has a length reaching a center of the substrate held by the substrate holder from the first nozzle operating device when the first nozzle swings in a plan view viewed in a direction perpendicular to the surface of the substrate,
• the second nozzle has a length reaching the center of the substrate held by the substrate holder from the second nozzle operating device when the second nozzle swings in the plan view, and
• the controller, during the substrate processing, causes the first nozzle mechanism and the second nozzle mechanism to swing independently of each other in a state where the substrate is rotated by the substrate holder.