C23C 16/4557
Heated nozzles
Official title: {Heated nozzles}
C23C16/4557 (Heated nozzles) appears on 342 US grants and 488 published applications in this corpus.
Search patents in C23C- Granted patents
- 342
- Published applications
- 488
- Assignees
- 146
- Inventors
- 1,146
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 2 | 0 |
| 1991 | 2 | 0 |
| 1992 | 2 | 0 |
| 1993 | 1 | 0 |
| 1994 | 1 | 0 |
| 1995 | 6 | 0 |
| 1996 | 2 | 0 |
| 1997 | 6 | 0 |
| 1998 | 4 | 0 |
| 1999 | 8 | 0 |
| 2000 | 19 | 0 |
| 2001 | 14 | 10 |
| 2002 | 16 | 22 |
| 2003 | 8 | 21 |
| 2004 | 5 | 14 |
| 2005 | 11 | 20 |
| 2006 | 4 | 9 |
| 2007 | 4 | 9 |
| 2008 | 10 | 22 |
| 2009 | 2 | 20 |
| 2010 | 3 | 16 |
| 2011 | 13 | 16 |
| 2012 | 12 | 24 |
| 2013 | 11 | 18 |
| 2014 | 9 | 14 |
| 2015 | 18 | 14 |
| 2016 | 6 | 12 |
| 2017 | 9 | 19 |
| 2018 | 9 | 15 |
| 2019 | 12 | 28 |
| 2020 | 18 | 27 |
| 2021 | 10 | 24 |
| 2022 | 18 | 29 |
| 2023 | 23 | 21 |
| 2024 | 17 | 23 |
| 2025 | 15 | 20 |
| 2026 | 11 | 21 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Semiconductor process chamber6 Oct 2026US 12,753,503 B2Hanwha Precision Machinery Co., Ltd.
- Film deposition apparatus21 Jul 2026US 12,689,003 B2Tokyo Electron Limited
- Showerhead assembly with heated showerhead2 Jun 2026US 12,644,183 B2APPLIED Materials.Inc.
- Showerhead assembly and substrate processing apparatus19 May 2026US 12,629,702 B2Tes Co., Ltd
- System and method for forming large-area electronic-grade metal chalcogen thin films5 May 2026US 12,618,146 B2The University of Hong Kong
- Wafer treating method24 Sep 2026US 2026/0286521 A1Asahi-Utou Technology Co., Ltd.
- Film forming method and film forming apparatus3 Sep 2026US 2026/0262453 A1Tokyo Electron Limited
- Nozzle cleaning method, crystalline oxide film formation method, and film formation apparatus6 Aug 2026US 2026/0226613 A1Shin-Etsu Chemical Co., Ltd.
- System and method for forming large-area electronic-grade metal chalcogen thin films16 Jul 2026US 2026/0201549 A1
- Wafer treating device and wafer treating method9 Jul 2026US 2026/0193780 A1Asahi-Utou Technology Co., Ltd.
Most cited
By later US patents
- Shower head and film forming apparatus using the same883US 5,595,606 ATokyo Electron Limited · 1997
- Process feed management for semiconductor substrate processing741US 9,017,481 B1ASM America, Inc. · 2015
- Programmable multizone gas injector for single-wafer semiconductor processing equipment740US 5,453,124 ATexas Instruments Incorporated · 1995
- Film deposition apparatus and film deposition method738US 8,506,713 B2Tokyo Electron Limited · 2013
- Deposition reactor having vaporizing, mixing and cleaning capabilities631US 6,454,860 B2APPLIED Materials.Inc. · 2002