US 9,017,481 B1Granted

Process feed management for semiconductor substrate processing

AssigneeASM America, Inc.

InventorsFred Pettinger, Carl White, Dave Marquardt, Sokol Ibrani, Eric Shero, Todd Dunn, Kyle Fondurulia, Mike Halpin

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Abstract

Embodiments related to managing the process feed conditions for a semiconductor process module are provided. In one example, a gas channel plate for a semiconductor process module is provided. The example gas channel plate includes a heat exchange surface including a plurality of heat exchange structures separated from one another by intervening gaps. The example gas channel plate also includes a heat exchange fluid director plate support surface for supporting a heat exchange fluid director plate above the plurality of heat exchange structures so that at least a portion of the plurality of heat exchange structures are spaced from the heat exchange fluid director plate.

Claims6

Dependent claims

A heat exchanger for a showerhead volume of a semiconductor process module, comprising:

a heat exchange plenum assembly comprising a heat exchange fluid director plate and a cover plate;
and
a gas channel plate including:
a heat exchange surface including a plurality of heat exchange structures separated from one another by intervening gaps, and
a heat exchange fluid director plate support surface for supporting the heat exchange fluid director plate above the plurality of heat exchange structures so that at least a portion of the plurality of heat exchange structures are spaced from the heat exchange fluid director plate,
wherein a heat exchange fluid channel is formed between the heat exchange surface and the heat exchange fluid director plate, and
wherein heat exchange fluid flows from the heat exchange plenum to the heat exchange fluid channel.

4 more elements

Dependencies are inferred from the claim text.