151,906 results
PatentTitle and first matching claimMatch
- US 2026/0324484 A1Published 15 Oct 2026Interfaces for coupling semiconductor systems with solder-masked substrates
Micron Technology, Inc.
- US 2026/0324464 A1Published 15 Oct 2026Vertical-interconnect packaging substrate, fabrication method, and copper electroplating method for via filling
Suzhou Bozhi Jinzuan Technology Co., Ltd.
- US 2026/0324449 A1Published 15 Oct 2026Methods and systems of manufacturing substrates having micro-holes
United Benefit Corp.
- US 2026/0324346 A1Published 15 Oct 2026Heating power control for semiconductor structure processing
ASM IP Holding B.V.
- US 2026/0324337 A1Published 15 Oct 2026Purging in load lock chambers
ASM IP Holding B.V.
- US 2026/0324311 A1Published 15 Oct 2026Cyclic etching and deposition to control film profile
Lam Research Corporation
- US 2026/0324309 A1Published 15 Oct 2026Substrate processing method and substrate processing apparatus
Tokyo Electron Limited
- US 2026/0324306 A1Published 15 Oct 2026Film forming method and film forming apparatus
Tokyo Electron Limited
- US 2026/0322291 A1Published 15 Oct 2026Electrostatic chuck, substrate support, and substrate processing apparatus
Tokyo Electron Limited
- US 2026/0321560 A1Published 15 Oct 2026A method for manufacturing a carbon-based radiation window and a carbon-based radiation window
Esa KOSTAMO, Pekka TÖRMÄ +1inventors
- US 2026/0321559 A1Published 15 Oct 2026Sputtering target bonding method and target assemblies produced thereby
Honeywell International Inc.
- US 2026/0321558 A1Published 15 Oct 2026Inverted Cylindrical Magnetron (ICM) System and Methods of Use
Vactronix Scientific, LLC
- US 2026/0321557 A1Published 15 Oct 2026Self-cleaning inductively coupled plasma source
Lam Research Corporation
- US 2026/0321556 A1Published 15 Oct 2026Apparatus with heated filter and operation method of the same
Taiwan Semiconductor Manufacturing Company, Ltd.
- US 2026/0321550 A1Published 15 Oct 2026Showerhead optimization for reducing showerhead impedance in semiconductor fabrication equipment
Lam Research Corporation
- US 2026/0321544 A1Published 15 Oct 2026Film deposition apparatus
Tokyo Electron Limited
- US 2026/0319356 A1Published 15 Oct 2026Planarized structure
Canatu Finland Oy
- US 2026/0319154 A1Published 15 Oct 2026Wire grid polarizing element and method for producing same
National Institute of Advanced Industrial Science and Technology
- US 2026/0317909 A1Published 15 Oct 2026Method for manufacturing surface-treated metal material and method for manufacturing joined body
Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.)
- US 2026/0317908 A1Published 15 Oct 2026Integration of barrier coatings into film manufacture
Nfinite Nanotechnology Inc.
- US 2026/0317907 A1Published 15 Oct 2026Heating apparatus having electrostatic attraction function
Shin-Etsu Chemical Co., Ltd.
- US 2026/0317906 A1Published 15 Oct 2026Annular pumping for chamber
Lam Research Corporation
- US 2026/0317905 A1Published 15 Oct 2026isolation plate for use in semiconductor processing chamber and related methods
Applied Materials, Inc.
- US 2026/0317904 A1Published 15 Oct 2026Thin films containing silicon, nitrogen, and carbon
ASM IP Holding B.V.
- US 2026/0317903 A1Published 15 Oct 2026