Wafer treating device and wafer treating method

A wafer treating device, comprising:

• a processing chamber configured as an accommodation space for processing a wafer;
• a wafer supporting and heating unit disposed in the processing chamber for carrying the wafer;
• a shower head corresponding to the wafer supporting and heating unit and disposed at a top portion of the processing chamber;
• a first top gas source connected to the top portion of the processing chamber through a first top supply pipe, wherein the first top supply pipe is provided with a first top supply valve;
• a second top gas source connected to the top portion of the processing chamber through a second top supply pipe, wherein the second top supply pipe is provided with a second top supply valve;
• a first side gas source connected to a side wall of the processing chamber through a first side supply pipe, wherein the first side supply pipe is provided with a first side supply valve;
• and
• a second side gas source connected to the side wall of the processing chamber through a second side supply pipe, wherein the second side supply pipe is provided with a second side supply valve;
• wherein the first top gas source and the second side gas source are configured to simultaneously supply gas to the processing chamber, and the first top gas source and the second top gas source do not simultaneously supply gas to the processing chamber.