H10W 90/761
Of strap connectors
Official title: {of strap connectors}
H10W90/761 (Of strap connectors) appears on 2,186 US grants and 2,858 published applications in this corpus.
Search patents in H10W- Granted patents
- 2,186
- Published applications
- 2,858
- Assignees
- 397
- Inventors
- 3,297
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 2 | 0 |
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 2 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 4 | 0 |
| 1989 | 3 | 0 |
| 1990 | 2 | 0 |
| 1991 | 3 | 0 |
| 1992 | 1 | 0 |
| 1993 | 2 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 3 | 0 |
| 1997 | 3 | 0 |
| 1998 | 3 | 0 |
| 1999 | 1 | 0 |
| 2000 | 6 | 0 |
| 2001 | 7 | 6 |
| 2002 | 11 | 21 |
| 2003 | 24 | 19 |
| 2004 | 18 | 30 |
| 2005 | 18 | 35 |
| 2006 | 25 | 49 |
| 2007 | 28 | 85 |
| 2008 | 26 | 61 |
| 2009 | 44 | 82 |
| 2010 | 64 | 66 |
| 2011 | 66 | 82 |
| 2012 | 78 | 122 |
| 2013 | 108 | 112 |
| 2014 | 92 | 141 |
| 2015 | 142 | 155 |
| 2016 | 138 | 136 |
| 2017 | 143 | 154 |
| 2018 | 127 | 144 |
| 2019 | 130 | 138 |
| 2020 | 117 | 145 |
| 2021 | 133 | 202 |
| 2022 | 132 | 186 |
| 2023 | 127 | 181 |
| 2024 | 134 | 200 |
| 2025 | 125 | 165 |
| 2026 | 87 | 141 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H10W 90/766Between a chip and a stacked lead frame, conducting package substrate or1,306
- H10W 90/764Between a chip and a stacked insulating package substrate, interposer or rdl614
- H10W 90/763Between laterally-adjacent chips601
- H10W 90/767Between a chip and a laterally-adjacent lead frame, conducting package substrate or70
- H10W 90/762Between stacked chips36
- H10W 90/765Between a chip and a laterally-adjacent insulating package substrate, interposer or rdl24
- H10W 90/769Between a chip and a laterally-adjacent discrete passive device13
- H10W 90/768Between a chip and a stacked discrete passive device1
Recent patents
- Package with low-warpage carrier6 Oct 2026US 12,757,756 B2Infineon Technologies AG
- Semiconductor device29 Sep 2026US 12,751,295 B2Rohm Co., Ltd.
- Power semiconductor module29 Sep 2026US 12,751,317 B2Wuxi Leapers Semiconductor Co., Ltd.
- Current sensor with inverted shielding element15 Sep 2026US 12,740,436 B2Littelfuse Semiconductor (Wuxi) Co., Ltd.
- Semiconductor device and method for manufacturing semiconductor device15 Sep 2026US 12,740,458 B2Mitsubishi Electric Corporation
- Isolated metal clips with structural bridge8 Oct 2026US 2026/0314452 A1Analog Devices, Inc.
- Semiconductor device and vehicle8 Oct 2026US 2026/0314464 A1Fuji Electric Co., Ltd.
- Power electronics module and inverter including a power electronics module8 Oct 2026US 2026/0314465 A1Schaeffler Technologies AG & Co. KG
- Three-dimensional chip stack with backside power distribution network8 Oct 2026US 2026/0314486 A1International Business Machines Corporation
- Semiconductor device, semiconductor module, and vehicle8 Oct 2026US 2026/0314507 A1Rohm Co., Ltd.
Most cited
By later US patents
- Semiconductor device including cladded base plate274US 8,963,321 B2Infineon Technologies AG · 2015
- Self-centering electrode for power devices249US 4,935,803 AMotorola, Inc. · 1990
- Semiconductor package243US 6,040,626 AInternational Rectifier Corporation · 2000
- Symmetrical package for semiconductor die208US 6,256,200 B12001
- Mold-type semiconductor device207US 5,218,231 AKabushiki Kaisha Toshiba · 1993