H10W 90/767
Between a chip and a laterally-adjacent lead frame, conducting package substrate or
Official title: {between a chip and a laterally-adjacent lead frame, conducting package substrate or heat sink}
H10W90/767 (Between a chip and a laterally-adjacent lead frame, conducting package substrate or) appears on 70 US grants and 123 published applications in this corpus.
Search patents in H10W- Granted patents
- 70
- Published applications
- 123
- Assignees
- 30
- Inventors
- 258
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2013 | 0 | 3 |
| 2014 | 1 | 0 |
| 2015 | 1 | 1 |
| 2016 | 2 | 0 |
| 2017 | 0 | 3 |
| 2018 | 4 | 1 |
| 2019 | 3 | 6 |
| 2020 | 4 | 4 |
| 2021 | 7 | 10 |
| 2022 | 3 | 11 |
| 2023 | 7 | 20 |
| 2024 | 7 | 32 |
| 2025 | 14 | 13 |
| 2026 | 17 | 19 |
By publication year. 2026 runs to 8 Oct.
Recent patents
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- Power semiconductor device25 Aug 2026US 12,721,245 B2Infineon Technologies Austria AG
- Semiconductor module18 Aug 2026US 12,713,941 B2Fuji Electric Co., Ltd.
- Semiconductor device for upper and lower arm circuits21 Jul 2026US 12,690,471 B2Denso Corporation
- Semiconductor device and vehicle8 Oct 2026US 2026/0314464 A1Fuji Electric Co., Ltd.
- Semiconductor device and vehicle3 Sep 2026US 2026/0262497 A1Rohm Co., Ltd.
- Method of manufacturing semiconductor devices and corresponding semiconductor device30 Jul 2026US 2026/0223720 A1STMicroelectronics International N. V.
- Semiconductor package having a die pad, a semiconductor transistor die and a layer structure having a ceramic layer23 Jul 2026US 2026/0215294 A1Infineon Technologies Austria AG
- Method of manufacturing semiconductor devices and corresponding semiconductor device23 Jul 2026US 2026/0215349 A1STMicroelectronics International N. V.
Most cited
By later US patents
- Multichip power semiconductor device5US 8,916,968 B2Infineon Technologies AG · 2014
- Semiconductor device using diffusion soldering5US 8,975,117 B2Infineon Technologies AG · 2015
- Semiconductor package with solder standoff3US 11,177,197 B2Texas Instruments Incorporated · 2021
- Clip and related methods2US 10,121,763 B2Semiconductor Components Industries, LLC · 2018
- Clip and related methods2US 9,911,712 B2Semiconductor Components Industries, LLC · 2018