Method of manufacturing semiconductor devices and corresponding semiconductor device

A method, comprising:

• arranging a semiconductor die at a die pad of a leadframe comprising an array of electrically conductive leads around the die pad, wherein at least one lead in the array of electrically conductive leads comprises a base lead portion co-planar with the die-pad and a raised lead portion, wherein the die pad is arranged at a downset location with respect to said raised lead portion;
• encapsulating the base and raised lead portions of the leadframe and the semiconductor die arranged on the die pad in an encapsulation of laser direct structuring (LDS) material;
• and
• forming, via LDS processing of the encapsulation of LDS material, at least one electrically conductive path electrically coupling the semiconductor die and the at least one lead in the array of electrically conductive leads, wherein said at least one electrically conductive path comprises a first electrically conductive via towards the semiconductor die and a second electrically conductive via towards said raised lead portion of said at least one lead in the array of electrically conductive leads.