Clip and related methods
AssigneeSemiconductor Components Industries, LLC
InventorsChee Hiong Chew, Atapol Prajuckamol, Yushuang Yao
Life of this patent
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Abstract
A clip for a semiconductor package. Implementations may include: an electrically conductive clip having a first end and a second end and a middle section between the first end and the second end. The first end may be configured to couple to a first die through a bonding material. The second end may be configured to couple to a second die through a bonding material. The middle section may be configured to couple to an emitter structure through a bonding material. The clip may include an integrally formed electrically conductive material and include an M-shape. A middle of the M-shape may be coupled to the emitter structure.
Claims13
A clip for a semiconductor package comprising:
- an electronically conductive clip having a first end and a second end and a middle section between the first end and the second end;
- wherein the first end is configured to couple to a first die through a bonding material;
- wherein the second end is configured to couple to a second die through a bonding material;
- wherein the middle section is configured to couple to an emitter structure through a bonding material, the emitter structure physically separate from the first die and from the second die;
- wherein the clip comprises an integrally formed electrically conductive material and comprises an M-shape;
- wherein the second end is adjacent to the middle section and is opposite the first end;
- wherein a middle of the M-shape is coupled to the emitter structure.
A semiconductor package comprising:
- a first collector coupled to a first die through a bonding material;
- a second collector coupled to a second die through a bonding material;
- an emitter located between the first collector and the second collector;
- and
- an M-shaped clip coupled to the first collector, the second collector, and the emitter through a bonding material;
- wherein a middle of the M-shape is coupled to the emitter;
- and
- wherein the middle of the M-shape forms a convex shape relative to a plane substantially parallel with the first die, the second die, and the emitter.
Dependencies are inferred from the claim text.