Clip and related methods
AssigneeSemiconductor Components Industries, LLC
InventorsChee Hiong Chew, Atapol Prajuckamol, Yushuang Yao
Life of this patent
Estimating the term…
Abstract
Implementations of a clip for a semiconductor package may include: an electrically conductive clip having a first end and a second end and a middle section between the first end and the second end. The first end may be configured to couple to a first die through a bonding material. The second end may be configured to couple to a second die through a bonding material. The middle section may be configured to couple to an emitter structure through a bonding material. The clip may include an integrally formed electrically conductive material and include an M-shape. A middle of the M-shape may be coupled to the emitter structure.
Claims20
A method of making a semiconductor package, the method comprising:
- patterning and etching a substrate to form a first collector, a second collector, and an emitter;
- applying bonding material to the first collector, the second collector, and the emitter;
- coupling a first die to the first collector and a second die to the second collector;
- applying bonding material to the first die and to the second die;
- and
- simultaneously mechanically and electrically coupling the first collector, the second collector, and the emitter through bonding an integrally formed clip to the first die, to the second die, and to the emitter through the bonding material.
A method of making a semiconductor package, the method comprising:
- patterning and etching a substrate to form a first collector, a second collector, and an emitter therein where the emitter is located between the first collector and the second collector;
- applying bonding material to the first collector, the second collector, and the emitter;
- coupling a first die to the first collector and a second die to the second collector;
- applying bonding material to the first die and to the second die;
- and
- simultaneously mechanically and electrically coupling the first collector, the second collector, and the emitter through bonding an integrally formed clip to the first die, to the second die, and to the emitter through the bonding material.
A method of making a semiconductor package, the method comprising:
- patterning and etching a substrate to form a first collector, a second collector, and an emitter therein where the emitter is located between the first collector and the second collector;
- applying bonding material to the first collector, the second collector, and the emitter;
- coupling a first die to the first collector and a second die to the second collector;
- applying bonding material to the first die and to the second die;
- and
- simultaneously mechanically and electrically coupling the first collector, the second collector, and the emitter through bonding an integrally formed clip comprising an M-shape to the first die, to the second die, and to the emitter through the bonding material.
Dependencies are inferred from the claim text.