H10W 90/764
Between a chip and a stacked insulating package substrate, interposer or rdl
Official title: {between a chip and a stacked insulating package substrate, interposer or RDL}
H10W90/764 (Between a chip and a stacked insulating package substrate, interposer or rdl) appears on 614 US grants and 850 published applications in this corpus.
Search patents in H10W- Granted patents
- 614
- Published applications
- 850
- Assignees
- 201
- Inventors
- 1,277
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 3 | 0 |
| 1989 | 2 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 1 | 0 |
| 1998 | 2 | 0 |
| 1999 | 1 | 0 |
| 2000 | 5 | 0 |
| 2001 | 4 | 2 |
| 2002 | 2 | 3 |
| 2003 | 5 | 7 |
| 2004 | 10 | 14 |
| 2005 | 5 | 8 |
| 2006 | 6 | 20 |
| 2007 | 8 | 31 |
| 2008 | 11 | 14 |
| 2009 | 15 | 18 |
| 2010 | 13 | 11 |
| 2011 | 11 | 14 |
| 2012 | 18 | 26 |
| 2013 | 25 | 29 |
| 2014 | 19 | 28 |
| 2015 | 32 | 35 |
| 2016 | 26 | 28 |
| 2017 | 35 | 41 |
| 2018 | 22 | 38 |
| 2019 | 35 | 32 |
| 2020 | 30 | 49 |
| 2021 | 46 | 79 |
| 2022 | 48 | 68 |
| 2023 | 42 | 67 |
| 2024 | 52 | 62 |
| 2025 | 49 | 64 |
| 2026 | 23 | 62 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Power semiconductor module29 Sep 2026US 12,751,317 B2Wuxi Leapers Semiconductor Co., Ltd.
- Semiconductor module having signal assembly in first and second molding compound15 Sep 2026US 12,740,495 B2Actron Technology Corporation
- Semiconductor device8 Sep 2026US 12,733,496 B2Power Master Semiconductor Co., Ltd.
- Semiconductor module, semiconductor device, and vehicle9 Jun 2026US 12,653,042 B2Fuji Electric Co., Ltd.
- Power module and electrical device26 May 2026US 12,640,660 B2BYD Company Limited
- Power electronics module and inverter including a power electronics module8 Oct 2026US 2026/0314465 A1Schaeffler Technologies AG & Co. KG
- Three-dimensional chip stack with backside power distribution network8 Oct 2026US 2026/0314486 A1International Business Machines Corporation
- Semiconductor device, semiconductor module, and vehicle8 Oct 2026US 2026/0314507 A1Rohm Co., Ltd.
- Semiconductor device10 Sep 2026US 2026/0271725 A1Nexperia B. V.
- Power semiconductor package including stacked contact clips, system and method for fabricating a power semiconductor package10 Sep 2026US 2026/0271768 A1Infineon Technologies AG
Most cited
By later US patents
- Semiconductor device including cladded base plate274US 8,963,321 B2Infineon Technologies AG · 2015
- Ball grid array semiconductor package and substrate without power ring or ground ring191US 6,667,546 B2Siliconware Precision Industries Co., Ltd. · 2003
- Wireless radio frequency power semiconductor devices using high density interconnect171US 5,637,922 AGeneral Electric Company · 1997
- Method of encapsulating a microelectronic assembly utilizing a barrier118US 6,130,116 ATessera, Inc. · 2000
- Reinforcement of lead bonding in microelectronics packages82US 6,239,489 B1Micron Technology, Inc. · 2001