Semiconductor module, semiconductor device, and vehicle

A semiconductor module, comprising:

• a stacked substrate including an insulating plate and a first circuit board arranged on an upper surface of the insulating plate;
• a semiconductor element arranged on an upper surface of the first circuit board;
• a metal wiring board including a first bonding portion bonded to an upper surface of the semiconductor element with a bonding material;
• and
• a sealing resin that seals the stacked substrate, the semiconductor element and the metal wiring board, wherein
• the first bonding portion has an upper surface and a lower surface opposite to each other and includes a plate-shaped portion,
• the metal wiring board has
• a first standing portion standing up from one end of the first bonding portion, and
• a second standing portion standing up from the other end of the first bonding portion opposite to the one end in a first direction,
• the first standing portion constitutes a part of a wiring path through which a main current of the semiconductor module flows, and
• the second standing portion constitutes a non-wiring path through which the main current does not flow.